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MC33FS6515KAER2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP, DCDC 1.5A VCO. Review the specifications below when checking this part for your BOM.
The MC33FS6515KAER2 is a System Basis Chip (SBC) from the FS6500 series, designed for automotive power train applications. It integrates a DC/DC switch-mode power supply with a 1.5 A output current capability to regulate MCU core voltage between 1.0 V and 5.0 V. The device supports CAN FD and LIN physical interfaces compliant with ISO11898-2 and LIN 2.2 standards. It operates within an ambient temperature range of -40°C to +125°C and features an LQFP-48EP package.
Verify the specific suffix 'KAER2' against official NXP documentation to confirm it denotes the AEC-Q100 Grade 0 high-temperature variant. Ensure the order matches the required thermal performance specifications for your application environment. Cross-reference the datasheet revision to confirm pinout and feature compatibility before finalizing procurement.
Select this component when designing systems requiring robust power management with integrated communication interfaces in a compact form factor. The 1.5 A DC/DC output is suitable for higher-power MCU cores. Consider the ASIL B/D readiness if functional safety compliance is mandatory. Verify that the LQFP-48EP package fits the PCB layout constraints and thermal dissipation requirements of the target design.
This part belongs to the NXP FS6500 family of System Basis Chips, which combine power management and communication interfaces. The FS6500 series is engineered to optimize energy consumption through ultra-low power modes while providing reliable power to microcontrollers in demanding automotive environments. It serves as a central hub for power distribution and network communication.
Consult NXP documentation for direct substitutes within the FS6500 family, such as variants with different current ratings or interface combinations. Ensure any replacement maintains the same package type and thermal grade requirements.
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