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MC33FS6525CAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP, DCDC 2.2A VCO. Review the specifications below when checking this part for your BOM.
The MC33FS6525CAE is a System Basis Chip (SBC) from NXP Semiconductors designed for automotive power train applications. It integrates a DC/DC switch-mode power supply (SMPS) capable of delivering up to 2.2 A for MCU core voltage regulation, alongside linear regulators. The device features integrated CAN FD and LIN physical interfaces compliant with ISO11898-2 and LIN standards. It supports ASIL B/D functional safety requirements and operates within an ambient temperature range of -40°C to +125°C. The component is housed in a 48-pin LQFP package.
Verify the specific suffix 'CAE' against the manufacturer's official datasheet to confirm pinout, thermal characteristics, and packaging details. Ensure compatibility with your system's voltage levels and communication protocols. Cross-reference the part number with NXP's official documentation to validate functional safety integrity levels and operating temperature ranges before integration.
Select this component when a single-chip solution is required for both power management and communication in automotive environments. It is suitable for designs needing a high-current core regulator combined with CAN FD and LIN connectivity. Consider its ASIL B/D readiness if functional safety certification is mandatory for the application.
This part belongs to the FS6500 family of System Basis Chips from NXP Semiconductors. These devices are engineered to simplify embedded design by combining power management, communication interfaces, and safety features into a single package. The family targets demanding automotive applications requiring high reliability and efficiency.
Consult NXP's official substitution guide for verified alternatives within the FS6500 series. Ensure any substitute matches the pinout, current capabilities, and safety integrity levels. Generic replacements may not support the same communication standards or thermal performance.
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