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MC33FS6525KAER2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP, DCDC 2.2A VCO. Review the specifications below when checking this part for your BOM.
The MC33FS6525KAER2 is a System Basis Chip (SBC) from NXP Semiconductors designed for automotive power train applications. It integrates a DC/DC converter capable of delivering 2.2 A to the Vcore rail, alongside multiple voltage regulators and communication interfaces. The device operates within an input voltage range typical for automotive systems and supports temperatures from -40°C to +125°C. Packaged in a 48-pin HLQFP (7x7 mm) reel, it serves as a central power management unit for microcontrollers in engine control modules.
Verify the exact suffix 'KAER2' against the manufacturer's official datasheet to confirm pinout, thermal pad configuration, and specific internal regulator settings. Ensure the ordering part number matches the required package variant and temperature grade. Cross-reference with NXP documentation to validate compatibility with target microcontroller power requirements before procurement.
Select this component when a single-chip solution is required to manage both power distribution and communication for an automotive microcontroller. It is suitable for designs needing a high-current Vcore supply integrated with standard PMIC features. Evaluate thermal performance and PCB layout constraints associated with the 48-pin LQFP package to ensure reliable heat dissipation under maximum load conditions.
This part belongs to the FS6500 series of System Basis Chips from NXP Semiconductors. These devices are engineered to simplify the design of automotive electronic control units by integrating essential power management and communication functions into a single compact package, reducing board space and component count compared to discrete solutions.
Consult NXP official substitution guides for compatible FS6500 series variants. Verify electrical compatibility and pin-to-pin equivalence before replacing existing inventory or redesigning circuits.
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