Power Management - Specialized MC33FS6525LAE product image

MC33FS6525LAE

$7.29
  • Description:SYSTEM BASIS CHIP, DCDC 2.2A VCO
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:55e146c2bee4 Category: Brand:

  
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MC33FS6525LAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP, DCDC 2.2A VCO. Review the specifications below when checking this part for your BOM.

Power Management - Specialized specifications for MC33FS6525LAE

  • Description:SYSTEM BASIS CHIP, DCDC 2.2A VCO
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:1V ~ 5V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP Exposed Pad
  • Supplier Device Package:48-HLQFP (7x7)
  • Grade:Automotive
  • Qualification:AEC-Q100

Power Management - Specialized datasheet and documents for MC33FS6525LAE

MC33FS6525LAE

Power Management - Specialized Overview

The MC33FS6525LAE is a safety power system basis chip from NXP Semiconductors, designed for automotive applications. It integrates DC/DC converters with a 2.2 A Vcore capability alongside CAN FD and LIN transceivers. The device operates within an input voltage range of 2.7 V to 40 V and supports output voltages from 1 V to 5 V. It functions reliably across a temperature range of -40°C to +125°C and is housed in an LQFP-48EP package.

Power Management - Specialized Feature Summary

  • Integrates high-current DC/DC converter with dedicated Vcore regulation
  • Includes integrated CAN FD and LIN transceivers for robust communication
  • Designed as a safety-oriented system basis chip for critical automotive systems

Power Management - Specialized Applications

  • Power Train control units
  • Automotive body electronics modules
  • Safety-critical embedded controller systems

Power Management - Specialized Procurement Notes

Verify the specific revision level and packaging configuration against the official NXP datasheet before procurement. Ensure compatibility with the target PCB footprint for the LQFP-48EP package. Confirm that the supply chain source provides genuine components with traceable documentation to meet automotive quality standards.

Power Management - Specialized Selection Notes

Select this component when a single-chip solution combining power management and dual-interface communication is required. It is suitable for designs needing high current delivery for processor cores while maintaining isolated CAN FD and LIN connectivity. Consider thermal performance requirements given the integrated power stages.

Power Management - Specialized Part Context

This part belongs to the FS6500 series of System Basis Chips from NXP Semiconductors. These devices are engineered to reduce board space and complexity by integrating multiple power rails and communication interfaces into a single safety-compliant package for automotive microcontrollers.

Power Management - Specialized Replacement Considerations

Consult NXP documentation for direct pin-to-pin or functional equivalents within the FS65xx family. Verify that any substitute maintains the same CAN FD and LIN transceiver specifications and output current capabilities.

MC33FS6525LAEMC33FS6525LAE
$7.29
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