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MC33FS8530A0ES is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP FS8500. Review the specifications below when checking this part for your BOM.
The MC33FS8530A0ES is an automotive, functionally safe multi-output power supply integrated circuit from the FS8500 series. It operates within an input voltage range of 5.1 V to 60 V and supports a maximum input current of 1.5 A. The device features a wide operating temperature range from -40°C to +125°C and consumes 15 mA during operation. Packaged in a 56-pin HVQFN (8x8 mm) with exposed pad, it meets AEC-Q100 qualification standards for automotive reliability.
Verify the complete part number including suffixes against official NXP documentation to ensure correct package and temperature grade. Confirm AEC-Q100 compliance requirements match your specific application standards. Check for moisture sensitivity level handling instructions due to the HVQFN package type. Ensure compatibility with existing board layout constraints for the 56-pin footprint.
Select this component when designing ADAS or domain controllers requiring a single-chip solution for multiple power rails. It is suitable for applications needing robust fault protection and functional safety integration. Consider the 60V input tolerance for direct battery connection scenarios. Evaluate thermal performance requirements given the dense HVQFN packaging.
This IC belongs to the FS8500 family of system basis chips, which are specialized PMICs for automotive electronics. The FS85 series targets high-performance computing nodes in vehicles, offering integrated power management and communication interfaces. It replaces discrete power solutions by consolidating regulators and protection circuits into a single compact package.
Consult NXP datasheets for direct pin-to-pin compatible alternatives within the FS8500 family. Verify that any substitute maintains identical functional safety integrity levels and output configurations. Cross-reference package dimensions and thermal characteristics to ensure mechanical fit.
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