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MC33GD3100EKR2
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Product Detailed Parameters
- Description：IC GATE DRVR HALF-BRIDGE 32SOIC
- Series：-
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR)
- Driven Configuration：Half-Bridge
- Channel Type：Single
- Number of Drivers：1
- Gate Type：IGBT, MOSFET (N-Channel)
- Voltage - Supply：5V
- Logic Voltage - VIL, VIH：-
- Current - Peak Output (Source, Sink)：15A, 15A
- Input Type：-
- Rise / Fall Time (Typ)：-
- Operating Temperature：-40°C ~ 125°C (TA)
- Mounting Type：Surface Mount
- Package / Case：32-BSSOP (0.295", 7.50mm Width)
- Supplier Device Package：32-SOIC
- Grade：Automotive
- Qualification：AEC-Q100
- High Side Voltage - Max (Bootstrap)：-
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Overview
The MC33GD3100EKR2 is a single-channel, current-isolated gate driver IC designed for IGBT and SiC power MOSFETs. It operates within a supply voltage range of 5V to 40V and features a low on-resistance of 500 mΩ. The device supports an operating temperature range from -40°C to +125°C and utilizes a WSOIC-32 surface-mount package. It integrates high charging and discharging currents with rail-to-rail gate voltage control.
Feature Summary
- Integrated current isolation and low on-resistance drive transistors for high efficiency
- Built-in current and temperature sensing to minimize stress during faults
- Configurable undervoltage lockout ensuring sufficient gate drive voltage margin
- Autonomous fault management with reporting via INTB pin and SPI interface
Applications
- xEV traction inverters
- Hybrid electric vehicle motor drive inverters
- EV DC-DC boost circuits
- Charging station systems
Procurement Notes
Verify the specific suffix EKR2 against official NXP documentation to confirm reel packaging and moisture sensitivity level requirements. Ensure compatibility with the FRDMGD3100HB8EVM development kit if evaluation is required. Confirm RoHS compliance status through the manufacturer's certification documents before finalizing procurement specifications.
Selection Notes
Select this component for designs requiring ASIL D functional safety certification in automotive traction applications. The integrated SPI interface allows for flexible configuration and diagnostic capabilities. Consider the 32-pin WSOIC package constraints and the need for external components supporting the 5V to 40V supply range when designing the power stage.
Part Context
This part belongs to the GD3100 series of advanced gate drivers from NXP Semiconductors. The series is engineered for high-reliability automotive systems, offering high integration to reduce BOM costs. It complements other NXP power management solutions by providing robust protection and control for wide-bandgap semiconductors.
Replacement Considerations
The MC33GD3100EK is a tube-packaged variant of the same functional device. Verify that the change in packaging format does not impact the automated assembly process or inventory handling procedures.
