MC33HB2002ES

MC33HB2002ES

$3.09
  • Description:H-BRIDGE, SPI, BRUSHED DC MOTOR
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:e4ec1bc49af1 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:H-BRIDGE, SPI, BRUSHED DC MOTOR
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Motor Type - Stepper:Bipolar
  • Motor Type - AC, DC:Brushed DC
  • Function:Driver - Fully Integrated, Control and Power Stage
  • Output Configuration:Half Bridge (2)
  • Interface:SPI
  • Technology:CMOS
  • Step Resolution:-
  • Applications:DC Motors
  • Current - Output:10A
  • Voltage - Supply:5V ~ 28V
  • Voltage - Load:5V ~ 28V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount, Wettable Flank
  • Package / Case:28-VQFN Exposed Pad
  • Supplier Device Package:28-HVQFN (6x6)
  • Grade:Automotive
  • Qualification:-

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MC33HB2002ES

Overview

The MC33HB2002ES is a single H-bridge brushed DC motor driver from NXP, designed for automotive and industrial applications. It integrates four low Rds(on) MOSFETs, a charge pump, and protection circuits within a compact HVQFN package. The device supports input voltages from 5V to 28V with peak tolerance up to 40V. Key features include SPI programmability for current limiting and slew rate adjustment, comprehensive diagnostic reporting via SPI, and robust thermal management through a high-conductivity mold connection and low thermal resistance pad.

Feature Summary

  • Integrated H-bridge power stage with low on-resistance MOSFETs for efficient motor control
  • SPI interface enabling dynamic configuration of current limits and output slew rates
  • Advanced diagnostic capabilities including short-circuit, open-load, and over-temperature detection
  • Compact HVQFN package optimized for thermal dissipation and space-constrained designs

Applications

  • Automotive electric vehicle systems
  • Internal combustion engine control units (ECU)
  • Industrial motor control applications

Procurement Notes

Verify the specific suffix 'ES' against official NXP documentation to confirm pinout, thermal characteristics, and packaging details. Ensure compatibility with system voltage requirements and SPI communication protocols before integration. Cross-reference the latest datasheet revision for any updates to electrical specifications or recommended operating conditions.

Selection Notes

Select this component when a single H-bridge solution with programmable diagnostics is required. It is suitable for applications needing precise current limiting and real-time fault monitoring via SPI. Consider the thermal performance of the HVQFN package relative to the expected load current and ambient temperature constraints.

Part Context

This part belongs to NXP's HB2000 series of H-bridge motor drivers, which are engineered to address space, heat, and cost challenges in electrified vehicles. The series offers improved thermal performance compared to previous generations, supporting the increasing number of motors in modern ECUs and EV systems.

Replacement Considerations

The MC33926AES is a related H-bridge driver in the same family. Verify functional compatibility and pinout alignment if substituting. Check datasheets for differences in current ratings, diagnostic features, and package dimensions.

MC33HB2002ESMC33HB2002ES
$3.09
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