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MC34PF3000A3EP is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC POWER MANAGEMENT 48QFN. Review the specifications below when checking this part for your BOM.
The MC34PF3000A3EP is a processor power management IC from NXP Semiconductors, designed for i.MX application processors. It operates within a supply voltage range of 2.8V to 5.5V and supports an operating temperature range of -40°C to 105°C. The device utilizes a 48-HVQFN (7x7) surface-mount package with exposed pad. It integrates multiple power rails including buck converters and linear regulators to support system components.
Verify the specific suffix 'EP' against official NXP documentation to confirm package type and moisture sensitivity level. Ensure compatibility with the target i.MX processor family before integration. Check for RoHS compliance status and lead time requirements directly with the manufacturer or authorized distributors. Confirm that the 48-HVQFN footprint matches the PCB design specifications.
Select this component when designing systems based on NXP i.MX 7 or single-core Cortex A9 processors requiring integrated power management. Consider the 48-HVQFN package size for space-constrained applications. Evaluate the need for programmable sequencing and low-power state retention features. Verify that the 2.8V to 5.5V input range aligns with the system power source capabilities.
The MC34PF3000 series belongs to NXP's PF3000 family of PMICs tailored for i.MX application processors. These devices utilize SMARTMOS technology to provide efficient power delivery. The series includes variants like MC34PF3000A3ES and MC34PF3001A3EP, differing in package and specific configuration options while maintaining core functionality for processor power management.
MC34PF3000A3ES is listed as a manufacturer-recommended alternative with identical electrical characteristics but potentially different packaging or tape-and-reel configuration. Verify pinout compatibility and thermal performance before substitution.
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