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MC35FS4503NAER2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is FS4500. Review the specifications below when checking this part for your BOM.
The MC35FS4503NAER2 is a System Basis Chip (SBC) from the NXP FS4500 series, designed for automotive applications. It integrates power management and communication interfaces to support Microcontroller Unit (MCU) systems. The device features a linear voltage regulator providing up to 0.5 A for the MCU core, with an output range of 1 V to 5 V. It operates within a supply voltage range of 2.7 V to 40 V and supports a junction temperature up to 175°C, meeting AEC-Q100 Grade 0 standards. The component is housed in a 48-HLQFP package.
Verify the specific suffix 'R2' indicates reel packaging rather than tray, as standard listings may default to tray quantities. Confirm the exact revision level against the latest NXP datasheet to ensure compatibility with current production versions. Check for RoHS compliance status and REACH registration details prior to finalizing procurement specifications.
Select this component when a robust SBC with integrated linear regulation is required for ASIL B/D ready applications. Ensure the design accommodates the 48-pin HLQFP footprint. Verify that the 0.5 A linear regulator output meets the peak current demands of the target MCU without exceeding thermal limits under maximum ambient conditions.
This part belongs to the FS4500 family of System Basis Chips, which combine power management with CAN FD and LIN transceivers. The FS4500 series is engineered for functional safety, offering advanced monitoring and low-power modes. It serves as a central node for managing power distribution and communication in complex automotive electronic architectures.
Consult the official NXP FS4500 product selector guide for verified cross-references. Potential substitutes include other variants within the MC35FS450x or MC33FS450x families, provided they match the specific pinout, regulatory grade, and thermal performance requirements.
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