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MC35FS6501CAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is FS6500. Review the specifications below when checking this part for your BOM.
The MC35FS6501CAE is a Grade 0 automotive System Basis Chip (SBC) from the FS6500 family, manufactured by NXP Semiconductors. It integrates a DC/DC switch-mode power supply (SMPS) delivering up to 0.8 A for MCU core voltage regulation, alongside linear regulators. The device supports an input operating voltage range of 2.7 V to 40 V and provides adjustable output voltages between 1 V and 5 V. It features integrated CAN FD and LIN physical interfaces compliant with ISO 11898-2/-5 and LIN standards. Designed for high-temperature environments, it operates within an ambient temperature range of -40°C to +150°C and a junction temperature up to 175°C, meeting AEC-Q100 Grade 0 qualification. The component is housed in a 48-pin LQFP package with exposed pad.
Verify the specific suffix 'CAE' corresponds to the tray packaging format as indicated in distributor specifications. Confirm that the Grade 0 designation aligns with the required thermal performance for your application's maximum ambient temperature constraints. Ensure compatibility with the FS6500 family software drivers and safety manuals provided by NXP. Cross-reference the manufacturing site and date code against your quality requirements. Check for any recent product change notifications regarding labeling or process updates.
Select this component when a robust Grade 0 SBC is required for high-temperature automotive environments exceeding Grade 1 limits. The 0.8 A SMPS output is suitable for mid-range MCU core currents. Consider the integrated CAN FD interface if high-speed network communication is needed without external transceivers. Evaluate the pinout and package size against PCB layout constraints. Compare against the MC33FS6501 series if Grade 1 qualification suffices for lower thermal budgets.
The MC35FS6501CAE belongs to the FS6500 family of Safety Power System Basis Chips designed for automotive microcontrollers. This family bridges power management and communication interfaces, reducing system complexity. The Grade 0 variant specifically targets demanding thermal conditions found in modern electric vehicle architectures. It complements NXP's broader portfolio of MCUs and gate drivers in complete EV solutions.
The MC33FS6501CAE serves as the Grade 1 alternative within the same package and feature set, offering lower thermal ratings. Other FS6500 variants with different current ratings (e.g., 1.5 A or 2.2 A SMPS) may be considered if higher core current is needed.
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