Power Management - Specialized MC35FS6503NAER2 product image

MC35FS6503NAER2

$5.51
  • Description:FS6500
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:e76de8d3c4f5 Category: Brand:

  
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MC35FS6503NAER2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is FS6500. Review the specifications below when checking this part for your BOM.

Power Management - Specialized specifications for MC35FS6503NAER2

  • Description:FS6500
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:1V ~ 5V
  • Operating Temperature:-40°C ~ 150°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP Exposed Pad
  • Supplier Device Package:48-HLQFP (7x7)
  • Grade:Automotive
  • Qualification:AEC-Q100

Power Management - Specialized datasheet and documents for MC35FS6503NAER2

MC35FS6503NAER2

Power Management - Specialized Overview

The MC35FS6503NAER2 is a System Basis Chip (SBC) and Power Management IC manufactured by NXP Semiconductors. It integrates multiple power management functions into a single component, designed for automotive applications. The device operates within an ambient temperature range of -40°C to 150°C. It is housed in a 48-LQFP Exposed Pad package with dimensions of 7x7 mm. The component complies with AEC-Q100 standards for automotive reliability and meets RoHS and REACH environmental directives.

Power Management - Specialized Feature Summary

  • Integrates multiple power management functions within a System Basis Chip architecture
  • Designed for robust operation in demanding automotive environments
  • Complies with strict automotive reliability standards including AEC-Q100

Power Management - Specialized Applications

  • Automotive system basis chip implementations
  • Power management integrated circuits for vehicle electronics
  • Motor control applications requiring reliable DSP controller support

Power Management - Specialized Procurement Notes

Verify the current lifecycle status before procurement, as sources indicate this part may be scheduled for obsolescence or discontinuation by the manufacturer. Confirm package compatibility with existing PCB footprints, specifically the 48-LQFP Exposed Pad configuration. Ensure design-in requirements align with the specified operating temperature range of -40°C to 150°C. Check for alternative components if long-term supply assurance is critical for the product roadmap.

Power Management - Specialized Selection Notes

Select this component when a consolidated System Basis Chip solution is required for automotive power management. It is suitable for designs needing integrated PMIC functionality within a compact 48-LQFP package. Consider its AEC-Q100 qualification for automotive-grade reliability. Evaluate the -40°C to 150°C operating range against thermal constraints. Verify that the specific integration features meet the system's power distribution needs without requiring additional discrete components.

Power Management - Specialized Part Context

This component belongs to the FS6500 series of System Basis Chips from NXP Semiconductors. These devices are engineered to simplify automotive electronic control unit designs by combining essential power management and communication interfaces. The MC35FS6503NAER2 variant specifically targets applications requiring high reliability and compliance with automotive industry standards, serving as a key element in modern vehicle power architectures.

Power Management - Specialized Replacement Considerations

Check official NXP documentation for direct pin-to-pin replacements or functional equivalents within the FS6500 family. Due to potential end-of-life status, identify qualified alternate suppliers or next-generation SBCs that maintain compatible package and electrical specifications.

MC35FS6503NAER2MC35FS6503NAER2
$5.51
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