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MC35FS6507CAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SYSTEM BASIS CHIP, DCDC 0.8A VCO. Review the specifications below when checking this part for your BOM.
The MC35FS6507CAE is a Grade 0 automotive System Basis Chip (SBC) from the FS6500 family, designed for power train applications. It integrates a DC/DC switch-mode power supply (SMPS) with a 1.5 A output current capability to supply MCU cores within a 1.0 V to 5.0 V range. The device supports an input voltage range of 2.7 V to 40 V and features integrated CAN FD and LIN physical interfaces compliant with ISO 11898-2, -5, and LIN standards. It operates at ambient temperatures up to 150°C and junction temperatures up to 175°C, meeting AEC-Q100 Grade 0 qualification. Packaged in LQFP-48EP.
Verify the specific suffix 'CAE' against official NXP documentation to confirm package type and tape-and-reel specifications. Ensure the selected variant matches the required thermal grade (Grade 0) and safety integrity level for your application. Cross-reference the datasheet revision date to confirm compatibility with your design requirements.
Select this component when a 1.5 A DC/DC output is required for MCU core power in Grade 0 automotive environments. Compare with MC35FS6500 variants if different current ratings or topology options are needed. Consider the MC35FS4500 series if a linear regulator solution suffices for lower current demands.
The MC35FS6507CAE belongs to the FS6500 System Basis Chip family, which combines power management and communication interfaces in a single package. This family targets automotive applications requiring high reliability and functional safety, offering integrated solutions for MCU powering and bus connectivity.
Official substitutes include other MC35FS6500xxx variants within the same family. Verify pinout and electrical characteristics before substitution. No direct cross-model replacements are confirmed without specific datasheet validation.
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