MC35FS6507NAER2

Power Management - Specialized Overview

The MC35FS6507NAER2 is a Grade 0 automotive System Basis Chip (SBC) from the FS6500 family, designed for high-temperature environments with an operating junction temperature up to 175°C. It integrates a DC/DC switch-mode power supply capable of delivering 1.5A to the MCU core, alongside linear regulators for I/O and auxiliary functions. The device features integrated CAN FD and LIN physical interfaces compliant with ISO 11898-2 and LIN 2.2 standards. It supports an input voltage range of 2.7V to 40V and operates within a temperature range of -40°C to +150°C.

Power Management - Specialized Feature Summary

• Integrated safety mechanisms including critical analog parameter monitoring and a fail-safe state machine for ASIL B/D applications
• Flexible SMPS pre-regulator supporting non-inverting buck-boost and standard buck topologies
• Low-power modes with multiple wake-up sources including CAN, LIN, I/O, and Long Duration Timer
• Built-in hardware security features and diagnostic capabilities to reduce software complexity

Power Management - Specialized Applications

• Power Train systems in electric and hybrid vehicles
• Body Control Modules requiring high thermal tolerance
• Sensor nodes demanding integrated power management and communication
• Automotive ECUs utilizing dual-core lockstep microcontrollers

Power Management - Specialized Procurement Notes

Verify that the specific suffix 'R2' corresponds to tape-and-reel packaging if reel handling is required for assembly, as opposed to tray packaging. Confirm the exact output current rating matches the system design requirements, as the FS6500 family includes variants with different current capabilities. Ensure compatibility with the target microcontroller's voltage levels and interface protocols before integration.

Power Management - Specialized Selection Notes

Select this component when a Grade 0 AEC-Q100 qualification is necessary for extreme thermal environments exceeding standard Grade 1 limits. Choose this part over lower-current variants if the MCU core requires 1.5A regulation. Consider the integrated CAN FD and LIN PHYs to simplify board layout compared to discrete transceiver solutions. Validate that the LQFP48EP package fits the thermal and spatial constraints of the application.

Power Management - Specialized Part Context

This part belongs to the NXP FS6500 System Basis Chip family, which combines power management with communication interfaces. It is specifically engineered for automotive applications requiring functional safety compliance. The MC35FS6507 variant represents the 1.5A DC/DC output option within the Grade 0 high-temperature segment of the portfolio.

Power Management - Specialized Replacement Considerations

MC35FS6507NAT