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MC35FS6512CAE is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is FS6500. Review the specifications below when checking this part for your BOM.
The MC35FS6512CAE is a Grade 0 automotive System Basis Chip from the FS6500 family, designed for high-temperature reliability with an operating junction temperature up to 175°C. It integrates a DC/DC pre-regulator capable of delivering 1.5 A to the MCU core, alongside linear regulators for auxiliary and I/O supplies. The device supports input voltages from 2.7 V to 40 V and features integrated CAN FD and LIN physical interfaces compliant with ISO 11898-2 and LIN 2.2 standards. Packaged in a 48-LQFP with exposed pad, it targets ASIL B/D applications.
Verify the specific suffix 'CAE' against official NXP documentation to confirm package type and tape-and-reel configuration. Ensure compatibility with ASIL B/D requirements by checking the full datasheet for safety manual details. Confirm moisture sensitivity level and reflow soldering profiles prior to assembly to prevent package damage during manufacturing processes.
Select this component when high-temperature operation up to 150°C ambient is required, distinguishing it from Grade 1 variants. Choose based on the need for a 1.5 A DC/DC output for the MCU core combined with integrated CAN FD connectivity. Consider the 48-LQFP package constraints and ensure the design supports the necessary SPI interface for control and diagnostics.
This part belongs to the FS6500 series of System Basis Chips, which combine power management and communication interfaces. It is positioned as a Grade 0 solution, offering higher thermal tolerance than Grade 1 counterparts like the MC33FS6500 series. The series is designed to simplify embedded designs by integrating multiple power rails and bus transceivers into a single compact package.
MC35FS6512NAE
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