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MC68360EM25K is listed in the Microprocessors range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MPU M683XX 25MHZ 240FQFP. Review the specifications below when checking this part for your BOM.
The MC68360EM25K is a QUad Integrated Communications Controller (QUICC) microprocessor IC from the M683xx series, manufactured by NXP USA Inc. It integrates a CPU32+ core with a Communications Processor Module (CPM). The device operates at a speed of 25MHz and features a 32-bit architecture. It supports Ethernet connectivity at 10Mbps and includes DRAM controllers. The component utilizes a 240-pin Plastic Quad Flat Package (PQFP) and is designed for surface mount applications.
Verify the specific package variant and voltage requirements against the target design specifications before procurement. Confirm that the ordering suffix corresponds to the required pinout and environmental rating. Ensure compatibility with existing board layouts regarding the 240-pin PQFP footprint. Check for any RoHS compliance status updates relative to manufacturing dates.
Select this component when a design requires a unified solution combining a 32-bit RISC processor with specialized hardware for serial protocol handling. Consider the integration of the CPM to reduce external logic complexity. Evaluate the 25MHz operating frequency against system timing constraints. Verify that the available I/O voltage levels match the peripheral requirements.
This part belongs to the M683xx family of QUICC devices, which are designed to bridge high-performance processing with efficient serial communication management. The MC68360 variant specifically targets applications needing substantial serial throughput without burdening the main CPU core. It represents an evolution in integrated communications controllers within the Freescale/NXP portfolio.
Consult official documentation for direct cross-references. Potential substitutes include variants within the same M683xx family such as the MC68EN360 series, provided pinouts and electrical characteristics align with the current design constraints.
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