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MC74AC273N is listed in the Flip Flops range at ChipApex. The manufacturer field lists onsemi. Its product description is IC FF D-TYPE SNGL 8BIT 20DIP. Review the specifications below when checking this part for your BOM.
The MC74AC273N is an octal D flip-flop manufactured by onsemi, belonging to the 74AC logic series. It features eight edge-triggered D-type flip-flops with individual data inputs and corresponding Q outputs. The device includes a common buffered clock input and a buffered asynchronous master reset input for simultaneous loading and clearing of all flip-flops. It operates within a supply voltage range of 2V to 6V and supports output source/sink currents of 24mA. The component is housed in a 20-PDIP package.
Verify component authenticity through authorized distributors and check manufacturer documentation for current status. Confirm RoHS compliance and material composition declarations prior to integration. Ensure packaging specifications match design requirements. Review technical datasheets for electrical characteristics and thermal limits. Validate pinout compatibility with existing circuit layouts.
Select this component when designing systems requiring octal data storage with synchronous clocking and global reset capabilities. Consider the 74AC series performance characteristics for speed and power consumption needs. Evaluate the 20-PDIP package suitability for through-hole assembly processes. Compare against similar parts like the MC74AC373 if transparent latch functionality is preferred over edge-triggered operation.
The MC74AC273N is part of onsemi's extensive 74AC logic family, which provides high-speed CMOS performance compatible with standard TTL inputs in its ACT variant counterparts. This specific model serves as a fundamental building block for sequential logic designs, offering reliable data retention and transfer capabilities in digital electronics.
Direct substitutes include SN74AC273N from Texas Instruments. Verify pinout and electrical parameter equivalence before substitution. Check for availability and lead time differences. Ensure package dimensions and mounting requirements are compatible with existing PCB footprints.
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