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MC74ACT174MEL is listed in the Flip Flops range at ChipApex. The manufacturer field lists onsemi. Its product description is IC FF D-TYPE SNGL 6BIT 16SOIC. Review the specifications below when checking this part for your BOM.
The MC74ACT174MEL is a hex D-type flip-flop manufactured by onsemi, belonging to the 74ACT logic series. It features positive edge triggering and provides true outputs without inversion. The device operates within a supply voltage range of 4.5 V to 5.5 V and supports surface mount installation in a 16-lead SOIC package. Key electrical specifications include a propagation delay of 11 ns, with high-level output current capability of -24 mA and low-level output current of 24 mA. The component is rated for an operating temperature range from -40°C to +85°C.
Verify component authenticity through authorized distributors or direct manufacturer channels due to potential availability constraints. Confirm RoHS compliance status and specific packaging variants such as tape and reel quantities prior to ordering. Ensure that the procurement channel provides valid traceability documentation to guarantee quality standards are met for industrial applications.
Select this component when designing systems requiring multiple independent D-type storage elements within a single package. The ACT series offers speed advantages over standard 74LS logic while maintaining pin compatibility. Consider the 11 ns propagation delay and 5V operation limits to ensure signal integrity matches system timing requirements and power supply stability.
This part belongs to the MC74ACT family of advanced CMOS logic devices produced by onsemi. The family is designed to bridge performance gaps between older TTL technologies and newer low-voltage CMOS solutions. These components are widely utilized in digital electronics for their reliability, speed, and broad operational temperature ranges suitable for various commercial and industrial environments.
Direct substitutes include MC74ACT174DR2G and MC74ACT174N. Verify package type consistency, specifically comparing SOIC-16 dimensions against alternatives like DIP-16 if leaded options are required. Ensure functional equivalence regarding pinout and electrical characteristics before swapping components in existing designs.
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