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MC74F174ML1 is listed in the Flip Flops range at ChipApex. The manufacturer field lists onsemi. Its product description is FLIP FLOP D TYPE BUS INTERFACE P. Review the specifications below when checking this part for your BOM.
The MC74F174ML1 is a Hex D-Type Flip-Flop integrated circuit manufactured by onsemi, belonging to the 74F logic series. It features six positive-edge-triggered D-type flip-flops with master reset functionality in a single package. The device utilizes Schottky TTL technology to achieve high-speed operation, characterized by a maximum propagation delay of 10 ns at 5V with 50pF load. It operates within a supply voltage range of 4.5V to 5.5V and supports standard through-hole mounting in a 16-DIP (0.300", 7.62mm) package.
Verify component authenticity through authorized distributors or direct manufacturer channels due to potential availability of refurbished units. Confirm package integrity and pin alignment prior to installation. Check RoHS compliance documentation if required for specific environmental standards. Ensure proper handling procedures are followed to prevent electrostatic discharge damage during assembly.
Select this component when high-speed performance is critical for hex flip-flop applications requiring Schottky TTL characteristics. Consider the 16-pin DIP package for through-hole prototyping or legacy board designs. Evaluate power consumption requirements as the series draws significant static current compared to CMOS alternatives. Verify voltage compatibility with existing 5V logic levels before integration into the system design.
This part belongs to the 74F family of logic ICs, known for offering speed comparable to the older 74AS series while maintaining lower power consumption. The MC74F174ML1 specifically addresses the need for multiple synchronized storage elements in compact packages. It serves as a fundamental building block for complex sequential logic designs requiring reliable high-frequency operation within industrial temperature ranges.
Direct substitute options include parts from other manufacturers offering identical logical functionality and pinout compatibility. Verify electrical specifications such as propagation delay and output drive current match original requirements. Ensure package dimensions and thermal characteristics remain compatible with existing PCB layouts and mounting constraints.
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