MC74HC173FL1

Flip Flops Overview

The MC74HC173FL1 is a high-speed CMOS D-type flip-flop manufactured by onsemi, featuring four independent positive-edge-triggered channels. It operates within a supply voltage range of 2V to 6V and supports clock frequencies up to 60MHz. The device exhibits a propagation delay of 34ns at 6V with a 50pF load. Packaged in SOIC-16 format, it provides reliable digital storage for synchronous data applications.

Flip Flops Feature Summary

• Four independent D-type flip-flops with positive-edge triggering
• High-speed operation supporting clock frequencies up to 60MHz
• Wide operating voltage range from 2V to 6V
• Low power consumption typical of advanced CMOS technology

Flip Flops Applications

• Synchronous data storage circuits
• Shift register implementations
• Timing control logic systems
• Digital signal processing interfaces

Flip Flops Procurement Notes

Verify component authenticity through authorized distributors due to potential counterfeit risks. Confirm RoHS compliance status as historical data indicates mixed availability. Check for obsolescence notices or lifecycle changes before finalizing procurement plans to ensure long-term supply stability.

Flip Flops Selection Notes

Select this component when four synchronized D-type storage elements are required in a compact surface-mount package. Ensure the design accommodates the specified 2V to 6V supply range and 60MHz maximum clock frequency. Consider the 34ns propagation delay for timing-critical path analysis during circuit simulation.

Flip Flops Part Context

Part of the HC series logic family, offering standard CMOS compatibility with TTL input levels. Designed for general-purpose digital logic applications requiring reliable state retention. The FL1 suffix denotes specific packaging and environmental specifications consistent with onsemi's industrial-grade product line.

Flip Flops Replacement Considerations

Direct substitutes include SN74HC173N (Texas Instruments) and CD74HC173E (Texas Instruments). Verify pinout compatibility and electrical parameter alignment before substitution. Alternative packages may require PCB layout adjustments.