MC74HC365ADTG

Overview

The MC74HC365ADTG is a hex buffer and line driver from the onsemi 74HC series, housed in a 16-TSSOP package. It features six non-inverting outputs with three-state capability. The device operates within a supply voltage range of 2 V to 6 V. Key electrical parameters include a propagation delay of 20 ns, high-level output current of -7.8 mA, and low-level output current of 7.8 mA. Quiescent current is specified at 4 uA, with a maximum operating temperature of +125 C.

Feature Summary

• Provides six independent non-inverting buffer channels for signal transmission.
• Integrates three-state output control to facilitate bus-oriented architectures.
• Operates across an extended industrial temperature range up to +125 C.

Applications

• Bus-oriented systems requiring signal buffering
• Clock distribution networks
• Memory address decoding circuits

Procurement Notes

Verify the specific suffix 'DG' against the requested 'TG' designation, as package variations may exist between TSSOP and SOIC forms. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure the selected variant matches the required pinout and thermal characteristics for the target PCB layout.

Selection Notes

Select this component when a wide supply voltage range including 2 V operation is required, distinguishing it from HCT variants limited to 5 V logic levels. The HC series offers higher speed performance compared to standard 74LS logic while maintaining CMOS power efficiency. Evaluate the 16-TSSOP package constraints against available board space and thermal dissipation requirements.

Part Context

This part belongs to the MC74HC365A family of hex buffers. It serves as a complementary device to the MC74HC367A octal buffer. The series is designed for general-purpose digital applications requiring reliable signal integrity and noise immunity within standard CMOS logic environments.

Replacement Considerations

MC74HC365ADTR2G is a verified substitute offering identical logical functionality in a tape-and-reel packaging format suitable for automated surface-mount assembly processes.