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MC74HCT273ADWG is listed in the Flip Flops range at ChipApex. The manufacturer field lists onsemi. Its product description is IC FF D-TYPE SNGL 8BIT 20SOIC. Review the specifications below when checking this part for your BOM.
The MC74HCT273ADWG is an octal D-type flip-flop from the 74HCT logic family, manufactured by onsemi. It features eight non-inverting outputs and operates within a supply voltage range of 4.5 V to 5.5 V. The device utilizes a 20-pin SOIC package for surface-mount installation. Key electrical parameters include a maximum propagation delay of 37 ns at 5 V with 50 pF load capacitance, and output drive currents of 4.8 mA for both high and low states. It supports a wide operating temperature range from -40 °C to +85 °C.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and material declarations prior to procurement. Ensure handling procedures account for moisture sensitivity classification to prevent internal damage during soldering processes. Cross-reference datasheet revisions to guarantee compatibility with specific design requirements.
Select this component when designing systems requiring octal storage with TTL-compatible inputs. The HCT series offers superior noise immunity compared to standard HC logic while maintaining pin-out compatibility. Consider the 20-pin SOIC package dimensions for PCB layout constraints. Evaluate thermal performance within the specified industrial temperature range to ensure reliable operation under varying environmental conditions.
This part belongs to the widely adopted 74HCT logic family, known for bridging CMOS and TTL technologies. The MC74HCT273A variant specifically provides octal storage capabilities, distinguishing it from dual or quad configurations. It serves as a fundamental building block for complex digital architectures requiring robust data retention and synchronization across multiple channels simultaneously.
Compatible substitutes include MM74HCT273M and MC74HCT273ADTR2G, provided package type and electrical specifications match design requirements. Verify that alternative sources maintain identical pin assignments and functional characteristics to avoid redesign efforts.
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