Flip Flops MC74HCT574ANG product image

MC74HCT574ANG

  • Description:IC FF D-TYPE SNGL 8BIT 20DIP
  • Series:74HCT
  • Mfr:onsemi
  • Package:Tube

SKU:8c3cd412ee30 Category: Brand:

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MC74HCT574ANG is listed in the Flip Flops range at ChipApex. The manufacturer field lists onsemi. Its product description is IC FF D-TYPE SNGL 8BIT 20DIP. Review the specifications below when checking this part for your BOM.

Flip Flops specifications for MC74HCT574ANG

  • Description:IC FF D-TYPE SNGL 8BIT 20DIP
  • Series:74HCT
  • Mfr:onsemi
  • Package:Tube
  • Function:Standard
  • Type:D-Type
  • Output Type:Tri-State, Non-Inverted
  • Number of Elements:1
  • Number of Bits per Element:8
  • Clock Frequency:30 MHz
  • Max Propagation Delay @ V, Max CL:30ns @ 5V, 50pF
  • Trigger Type:Positive Edge
  • Current - Output High, Low:6mA, 6mA
  • Voltage - Supply:4.5V ~ 5.5V
  • Current - Quiescent (Iq):4 µA
  • Operating Temperature:-55°C ~ 125°C (TA)
  • Mounting Type:Through Hole
  • Supplier Device Package:20-PDIP
  • Package / Case:20-DIP (0.300", 7.62mm)
  • Input Capacitance:10 pF
  • Grade:-
  • Qualification:-

Flip Flops datasheet and documents for MC74HCT574ANG

MC74HCT574ANG

Flip Flops Overview

The MC74HCT574ANG is an octal D-type flip-flop from the HCT logic series, manufactured by onsemi. It features eight positive-edge-triggered D-type flip-flops with output latches in a single package. The device operates within a supply voltage range of 4.5 V to 5.5 V and offers non-inverting outputs. Key electrical parameters include a propagation delay of 30 ns, high-level output current of -6 mA, and low-level output current of 6 mA. It is housed in a 20-DIP (0.300 inch, 7.62 mm) package and supports surface mount or through-hole installation styles.

Flip Flops Feature Summary

  • Octal configuration containing eight independent D-type flip-flops for parallel data storage
  • Positive-edge triggering mechanism ensures precise data capture at clock transitions
  • LSTTL-compatible input thresholds facilitate direct interfacing with legacy logic families
  • Non-inverting output polarity maintains signal directionality without additional inversion stages

Flip Flops Applications

  • Parallel-to-serial data conversion circuits
  • General-purpose register banks in digital systems
  • Shift register implementations for data movement
  • Memory buffer stages in microprocessor interfaces

Flip Flops Procurement Notes

Verify the specific ordering suffix to confirm the package type and tape/reel specifications, as variations exist within the product family. Ensure that the procurement source provides valid RoHS compliance documentation consistent with current manufacturing standards. Cross-reference the manufacturer part number against official distributor catalogs to avoid obsolete variants. Confirm that the component meets the required operating temperature range for your specific application environment before finalizing orders.

Flip Flops Selection Notes

Select this component when an octal storage element with LSTTL-compatible inputs is required. The HCT series ensures compatibility with standard CMOS logic levels while maintaining robust noise immunity. Consider the 20-DIP package for prototyping or applications requiring through-hole mounting. Evaluate the 30 ns propagation delay against system timing requirements to ensure adequate setup and hold times are met during operation.

Flip Flops Part Context

This component belongs to the MC74HCT574A series, representing a standard octal D-type flip-flop solution. It is designed for general-purpose digital logic applications requiring multiple synchronized storage elements. The device integrates eight flip-flops into a single integrated circuit, reducing board space compared to discrete solutions. It serves as a fundamental building block for sequential logic design in consumer and industrial electronics.

Flip Flops Replacement Considerations

MM74HCT574MTC: Offers identical logical function but utilizes a TSSOP-20 package instead of DIP. MM74HCT574WMX: Provides the same octal D-type functionality in an SOIC-20 package. Verify pinout compatibility and thermal characteristics when substituting these surface-mount alternatives.

MC74HCT574ANGMC74HCT574ANG

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