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MC74HCT74ADR2G-Q is listed in the Flip Flops range at ChipApex. The manufacturer field lists onsemi. Its product description is DUAL D FLIP-FLOP WITH SET AND RE. Review the specifications below when checking this part for your BOM.
The MC74HCT74ADR2G-Q is a dual D-type flip-flop from the HCT logic series, designed for high-speed digital applications. It features LSTTL-compatible inputs and CMOS outputs within a SOIC-14 surface-mount package. The device operates on a supply voltage ranging from 4.5 V to 5.5 V. Key electrical parameters include a propagation delay of 30 ns, with high-level and low-level output currents rated at 4 mA each. It supports an operating temperature range extending down to -55°C and holds AEC-Q100 qualification.
Verify that the specific suffix 'Q' denotes AEC-Q100 automotive qualification status as per official manufacturer documentation. Confirm the SOIC-14 package dimensions and pinout match the target PCB footprint design requirements. Ensure the supply voltage range of 4.5 V to 5.5 V aligns with the system power rail specifications before integration into the final assembly.
Select this component when LSTTL input compatibility is required alongside CMOS output performance in a compact surface-mount form factor. The HCT series is suitable for systems transitioning between TTL and CMOS logic families. Consider the 30 ns propagation delay for timing constraints and verify the 4 mA output current capability meets the load requirements of the connected downstream circuitry.
This part belongs to the MC74HCT74A family of dual D-type flip-flops manufactured by onsemi. The 'Q' suffix indicates compliance with automotive quality standards, specifically AEC-Q100, making it distinct from commercial grade variants. It is part of the broader 74HCT logic family, which bridges the gap between older TTL standards and modern CMOS technology.
Direct substitutes include other AEC-Q100 qualified dual D-type flip-flops such as the MC74HC74ADR2G-Q, though HC series inputs differ from HCT LSTTL compatibility. Verify package integrity and electrical characteristics against the original datasheet specifications to ensure functional equivalence in the target application.
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