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MC74LCX374MELG is listed in the Flip Flops range at ChipApex. The manufacturer field lists onsemi. Its product description is IC FF D-TYPE SNGL 8BIT 20SOEIAJ. Review the specifications below when checking this part for your BOM.
The MC74LCX374MELG is an obsolete 8-bit D-type flip-flop from the onsemi 74LCX series. It features positive-edge triggering and tri-state non-inverting outputs. The device operates within a supply voltage range of 2V to 3.6V, with a maximum clock frequency of 150 MHz. Propagation delay is specified at 8.5ns @ 3.3V, 50pF. Output drive capability is 24mA for both high and low states. Static current (Iq) is 10 µA. Input capacitance is 7 pF. It is housed in a 20-SOIC package (0.209", 5.30mm width). Operating temperature range is -40°C to +85°C.
Verify component status carefully as this part number is listed as obsolete and no longer manufactured by onsemi. Sourcing may be limited to distributor surplus or secondary market channels. Confirm authenticity and condition through authorized distributors. Check for available substitute part numbers such as MC74LCX374DTR2G if new production units are required for design continuity.
Select this component only for legacy system maintenance or repair where original part matching is critical. For new designs, consider active substitutes within the 74LCX374 family that offer identical pinouts and electrical characteristics. Evaluate availability constraints and potential long-term supply risks associated with obsolete logic devices before finalizing specifications.
This device belongs to the 74LCX374 family of octal D-type flip-flops with tri-state outputs. It is designed for low-voltage CMOS applications requiring high-speed performance. The LCX series offers compatibility with standard TTL interfaces while operating at lower voltages. This specific MELG variant utilizes a 20-SOIC package format suitable for surface-mount assembly.
MC74LCX374DTR2G is confirmed as an available substitute part number. Verify pinout compatibility and electrical parameters before substitution. Ensure packaging differences do not impact board layout requirements.
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