MC74LVX541DW

Overview

The MC74LVX541DW is an octal bus buffer fabricated with advanced high-speed silicon gate CMOS technology. It operates within a DC supply voltage range of 2.0 V to 3.6 V and features noninverting outputs controlled by two independent output enable inputs (OE1, OE2). The device provides balanced propagation delays and includes power-down protection on its inputs. It supports interface between 5.0 V systems and 3.0 V systems due to input voltage tolerance up to 6.5 V. The component is housed in a SOIC-20 package.

Feature Summary

• Advanced high-speed CMOS fabrication for operation similar to Bipolar Schottky TTL
• Dual independent output enables providing high impedance states when active
• Input voltage tolerance up to 6.5 V enabling 5.0 V to 3.0 V system interfacing
• Power-down protection provided on all inputs

Applications

• Memory and address drivers
• Clock drivers
• Bus-oriented transmitter/receivers

Procurement Notes

Verify the specific ordering suffix 'DW' corresponds to the SOIC-20 package variant. Confirm RoHS compliance status via the manufacturer's documentation. Ensure the procurement channel sources genuine components from authorized distributors to maintain reliability standards.

Selection Notes

Select this component for applications requiring octal buffering with low power dissipation and high noise immunity. Consider the 2 V to 3.6 V operating range and the requirement for dual output enables. Verify that the 6.5 V input tolerance meets the requirements for interfacing with higher voltage logic families.

Part Context

This part belongs to the LVX series of logic integrated circuits manufactured by onsemi. It functions as an octal bus buffer designed for high-speed data transfer applications. The device utilizes silicon gate CMOS technology to achieve performance comparable to Bipolar Schottky TTL while maintaining low power consumption characteristics typical of CMOS devices.

Replacement Considerations

Direct substitutes include the MC74LVX541DTR2G, which shares identical functionality but utilizes a TSSOP-20 package instead of the SOIC-20 form factor.