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Product Detailed Parameters
- Description:IC BUF NON-INVERT 5.5V 14SOIC
- Series:74VHC
- Mfr:onsemi
- Package:Tape & Reel (TR),Cut Tape (CT)
- Logic Type:Buffer, Non-Inverting
- Number of Elements:6
- Number of Bits per Element:1
- Input Type:-
- Output Type:Push-Pull
- Current - Output High, Low:8mA, 8mA
- Voltage - Supply:2V ~ 5.5V
- Operating Temperature:-55°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package:14-SOIC
- Grade:-
- Qualification:-
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Overview
The MC74VHC50DR2G is a hex non-inverting buffer and line driver manufactured by onsemi, belonging to the 74VHC logic series. It operates within a supply voltage range of 2 V to 5.5 V and features push-pull outputs capable of sourcing and sinking 8 mA. The device provides six independent channels in a 14-SOIC package. Key electrical parameters include a propagation delay of 10.6 ns, a maximum static current of 2 µA, and a power dissipation rating of 200 mW. It supports surface mount installation and functions reliably across an extended temperature range from -55°C to +125°C.
Feature Summary
- Hex configuration providing six independent non-inverting buffer channels for signal conditioning.
- CMOS technology enabling low static power consumption suitable for battery-operated applications.
- Push-pull output stage design delivering high drive capability with defined source and sink currents.
Applications
- Clock buffering and distribution in digital systems
- Address decoding circuits
- Memory interface drivers
Procurement Notes
Verify the specific ordering suffix DR2G to confirm the SOIC-14 package and tape-and-reel packaging format. Ensure compliance with RoHS3 standards and check the Moisture Sensitivity Level (MSL 1) for proper handling during assembly. Confirm the manufacturer part number matches exactly to avoid confusion with similar variants like the DTR2G TSSOP version.
Selection Notes
Select this component when a hex buffer is required for 2V to 5.5V logic families. The 14-SOIC package offers a balance between pin count and board space. Consider the 10.6 ns propagation delay for timing constraints. Verify that the 8 mA output current meets the load requirements of the connected circuitry without exceeding the thermal limits of the package.
Part Context
This part belongs to the MC74VHC50 series of hex buffers. It serves as a surface-mount replacement for through-hole versions like the MC74VHC50D. The DR2G suffix specifically denotes the SOIC-14 footprint and reel packaging, distinguishing it from other package options within the same logical family.
Replacement Considerations
MC74VHC50DTR2G is a verified substitute offering identical logical function in a TSSOP-14 package. Cross-reference pinouts to ensure compatibility with existing PCB footprints before substitution.
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