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MCD40-12IO6
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Product Detailed Parameters
- Description：MOD THYRISTOR/DIO 1200V SOT-227B
- Series：-
- Mfr：IXYS
- Package：Tube
- Structure：Series Connection - SCR/Diode
- Number of SCRs, Diodes：1 SCR, 1 Diode
- Voltage - Off State：1.2 kV
- Current - On State (It (AV)) (Max)：38 A
- Current - On State (It (RMS)) (Max)：60 A
- Current - Non Rep. Surge 50, 60Hz (Itsm)：500A, 440A
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SOT-227-4, miniBLOC
- Voltage - Gate Trigger (Vgt) (Max)：1.5 V
- Current - Gate Trigger (Igt) (Max)：100 mA
- Current - Hold (Ih) (Max)：200 mA
- Grade：-
- Qualification：-
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Overview
The IXYS MCD40-12IO6 is a discrete semiconductor module classified as a thyristor/diode assembly. It features a rated average on-state current (Irms) of 40A and a repetitive peak off-state voltage (Vrrm) of 1200V. The device supports a surge current rating of 3.5kA with a maximum gate trigger current (Igt) of 150mA. Designed for panel mounting, it utilizes a five-pin configuration and operates within a temperature range up to 125°C.
Feature Summary
- Integrated thyristor and diode structure in a single package
- Panel-mount construction for mechanical stability
- Five-terminal interface for circuit integration
Applications
- Industrial power control systems
- Energy conversion equipment
- Inverter circuits
Procurement Notes
Verify the manufacturer part number against official IXYS documentation to confirm technical specifications. Ensure the component matches the required electrical ratings for the intended application. Cross-reference datasheets for thermal management requirements and pinout configurations before procurement.
Selection Notes
Select this module based on the specific requirement for a combined thyristor and diode solution. Evaluate the 40A current rating and 1200V voltage capability against system load conditions. Consider the physical dimensions and panel-mount style for enclosure compatibility.
Part Context
This component belongs to the IXYS MCD series of discrete semiconductor modules. These devices are designed for robust performance in power electronics applications requiring high reliability. The series typically integrates multiple semiconductor functions into a compact form factor.
Replacement Considerations
Consult official IXYS documentation for confirmed substitute part numbers. Verify that any alternative component matches the electrical ratings and physical footprint. Do not assume cross-compatibility without verifying pinout and thermal characteristics.
