MCE360CZQ25LR2

Microprocessors Overview

The MCE360CZQ25LR2 is a microprocessor unit from the NXP M683xx series, featuring a CPU32+ core with a 32-bit bus width. It operates at a maximum frequency of 25MHz and integrates a Communications Processor Module (CPM) for communication tasks. The device utilizes a 357-pin BBGA package measuring 25x25mm with a height of 1.15mm. It supports surface mount installation and functions within an ambient temperature range of -40°C to +85°C. The component includes DRAM controller capabilities and interfaces such as SCC, SMC, and SPI.

Microprocessors Feature Summary

• Integrates a CPU32+ processor core with a dedicated Communications Processor Module for handling communication protocols.
• Supports high-speed serial communication through integrated SCC, SMC, and SPI interfaces.
• Features an onboard DRAM controller for memory management.
• Designed for surface-mount technology in compact electronic assemblies.

Microprocessors Applications

• Industrial control systems requiring robust communication processing
• Automotive embedded applications utilizing CAN or serial interfaces
• Telecommunications equipment with serial data handling requirements

Microprocessors Procurement Notes

Verify component authenticity due to discontinued status. Confirm package integrity and pin alignment before soldering. Check for moisture sensitivity level compliance during storage. Ensure compatibility with existing PCB footprints for the 357-BBGA configuration. Validate thermal performance within the specified operating temperature range.

Microprocessors Selection Notes

Select this component for designs requiring ColdFire architecture integration. Consider the 25MHz speed limit for timing constraints. Evaluate the 357-pin BGA footprint against available board space. Assess the need for CPM offloading versus general-purpose processing. Verify voltage levels match system I/O requirements.

Microprocessors Part Context

This part belongs to the NXP M683xx family, which provides embedded solutions based on the ColdFire architecture. The series is known for integrating communication peripherals directly onto the die, reducing external component count. The MCE360 variant specifically targets applications needing reliable serial connectivity and moderate processing power.

Microprocessors Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult NXP official resources for current lifecycle status and potential obsolescence management strategies.