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Product Detailed Parameters
- Description:IC MPU I.MX53 1GHZ 529FBGA
- Series:i.MX53
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR)
- Core Processor:ARM® Cortex®-A8
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:1GHz
- Co-Processors/DSP:Multimedia; NEON™ SIMD
- RAM Controllers:LPDDR2, DDR2, DDR3
- Graphics Acceleration:Yes
- Display & Interface Controllers:Keypad, LCD
- Ethernet:10/100Mbps (1)
- SATA:SATA 1.5Gbps (1)
- USB:USB 2.0 (2), USB 2.0 + PHY (2)
- Voltage - I/O:1.3V, 1.8V, 2.775V, 3.3V
- Operating Temperature:-20°C ~ 70°C (TA)
- Security Features:ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:529-FBGA
- Supplier Device Package:529-FBGA (19x19)
- Additional Interfaces:1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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Overview
The MCIMX535DVV1C2R2 is a multimedia application processor from the NXP i.MX 53 family, built on an ARM Cortex-A8 core. It operates at a maximum clock frequency of 1 GHz and utilizes a 32-bit data bus. The device features a multi-level storage system including 32 kB L1 instruction and data caches, plus 256 kB L2 cache. It supports DDR2, DDR3, LPDDR2, and LVDDR2 memory types. Operating voltage ranges from 900 mV to 1.35 V, with I/O voltages of 1.3 V, 1.8 V, 2.775 V, and 3.3 V. The component is housed in a TEPBGA-529 package and functions within a temperature range of -20°C to +85°C.
Feature Summary
- Integrated dual graphics processing units supporting OpenGL ES 2.0 and OpenVG 1.1 standards for advanced visual rendering.
- Hardware-accelerated multimedia capabilities featuring a multi-standard video codec and intelligent DMA controller.
- Comprehensive connectivity interface suite including multiple USB ports, Ethernet, and display controllers.
- Hardware security features enabling secure boot, digital rights management, and data encryption.
Applications
- Multimedia consumer electronics
- Portable applications requiring high MIPS performance
- Industrial control systems
Procurement Notes
Verify the specific suffix '2R2' against official NXP documentation to confirm packaging details such as reel or cut tape specifications. Ensure compatibility with required memory interfaces (DDR2/DDR3/LPDDR2) and validate operating temperature ranges (-20°C to +85°C) for the target environment. Cross-reference the mask set status, as older markings may indicate obsolete revisions.
Selection Notes
Select this component for designs requiring a single-core ARM Cortex-A8 solution with integrated GPU acceleration. Consider the 529-ball BGA package constraints for PCB layout. Verify support for desired external memory types and peripheral interfaces like USB and Ethernet. Evaluate power consumption requirements against the dynamic voltage and frequency scaling capabilities inherent to the i.MX 53 architecture.
Part Context
This part belongs to the i.MX 53xD series, succeeding the i.MX 51 with improved performance and power efficiency. It is designed for portable applications demanding increased operating system MIPS and gaming capabilities. The processor integrates smart speed technology for power management across active and low-power modes.
Replacement Considerations
NXP has indicated that older mask sets associated with similar i.MX 53 variants are obsolete and replaced by newer revisions. Consult official substitution lists for updated part numbers with current mask sets.
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