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Product Detailed Parameters
- Description:IC MPU I.MX53 800MHZ 529FBGA
- Series:i.MX53
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:ARM® Cortex®-A8
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:800MHz
- Co-Processors/DSP:Multimedia; NEON™ SIMD
- RAM Controllers:DDR2, DDR3, LPDDR2
- Graphics Acceleration:Yes
- Display & Interface Controllers:Keypad, LCD
- Ethernet:10/100Mbps (1)
- SATA:SATA 1.5Gbps (1)
- USB:USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
- Voltage - I/O:1.3V, 1.8V, 2.775V, 3.3V
- Operating Temperature:-40°C ~ 125°C (TJ)
- Security Features:ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:529-FBGA
- Supplier Device Package:529-FBGA (19x19)
- Additional Interfaces:1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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Overview
The MCIMX536AVP8C2 is an automotive-grade application processor from NXP Semiconductors, belonging to the i.MX 536 series. It features a single-core ARM Cortex-A8 processor with a maximum clock frequency of 800 MHz and supports floating-point operations. The device utilizes a TEPBGA-529 package for surface mount installation. Key electrical parameters include operating supply voltages of 1.1 V and 1.3 V, with I/O voltage support for 1.3 V, 1.8 V, 2.5 V, 2.775 V, and 3.3 V. It operates within a temperature range of -40°C to +125°C. Memory specifications include 32 kB L1 instruction and data caches, a 256 kB L2 cache, and support for DDR3, DDR2/LVDDR2, and LPDDR2 DRAM types.
Feature Summary
- Automotive-grade reliability designed for infotainment systems
- Integrated hardware acceleration for graphics and multimedia processing
- Comprehensive connectivity interfaces including CAN, USB, SPI, and I2C
- Supports multiple external memory standards for flexible system design
Applications
- Automotive infotainment systems
- In-vehicle human-machine interface (HMI) displays
- Digital instrument clusters
- Telematics control units
Procurement Notes
Verify the specific suffix 'C2' against official NXP documentation to confirm pinout compatibility and feature set. Ensure the procurement channel provides valid RoHS compliance certificates. Confirm that the TEPBGA-529 package matches the target PCB footprint requirements. Check for any moisture sensitivity level restrictions during storage and handling prior to soldering.
Selection Notes
Select this component when designing automotive applications requiring robust performance in high-temperature environments up to 125°C. The 800 MHz Cortex-A8 core offers sufficient processing power for complex infotainment tasks. Consider the available I/O voltage options if interfacing with legacy automotive peripherals. Evaluate the integrated security features if protection against tampering is required for the final product.
Part Context
This processor is part of the broader i.MX family, specifically tailored for the automotive sector. It shares architectural similarities with other i.MX53 variants but is distinguished by its extended temperature range and automotive qualification. The device serves as a central processing unit for connected car technologies, bridging user interaction with vehicle network systems.
Replacement Considerations
Consult NXP datasheets for direct cross-references such as MCIMX536AVP8C2R2, which differs primarily in reel packaging rather than functional specifications. Verify that alternative parts maintain the same TEPBGA-529 footprint and thermal characteristics to ensure mechanical compatibility.
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