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Product Detailed Parameters
- Description:IC MPU I.MX6D 852MHZ 624FCBGA
- Series:i.MX6D
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR)
- Core Processor:ARM® Cortex®-A9
- Number of Cores/Bus Width:2 Core, 32-Bit
- Speed:852MHz
- Co-Processors/DSP:Multimedia; NEON™ SIMD
- RAM Controllers:LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:Yes
- Display & Interface Controllers:Keypad, LCD
- Ethernet:10/100/1000Mbps (1)
- SATA:SATA 3Gbps (1)
- USB:USB 2.0 + PHY (4)
- Voltage - I/O:1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:-40°C ~ 125°C (TJ)
- Security Features:ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:624-FBGA, FCBGA
- Supplier Device Package:624-FCBGA (21x21)
- Additional Interfaces:CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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Overview
The MCIMX6D4AVT08ACR is an i.MX 6Dual automotive-grade system-on-chip featuring dual Arm Cortex-A9 cores operating at 852 MHz. It utilizes a 624-pin FCBGA package with a 21x21 mm footprint and 0.8 mm pitch. The device supports DDR3, DDR3L, and LPDDR2 memory interfaces and includes integrated VPU and GPU hardware accelerators. It operates within a junction temperature range of -40°C to +125°C and complies with AEC-Q100 standards.
Feature Summary
- Automotive-grade qualification compliant with AEC-Q100 standards for extended temperature operation up to 125°C.
- Integrated multimedia acceleration including Video Processing Unit (VPU) and 3D/2D Graphics Processing Units (GPU).
- Advanced hardware security features including High Assurance Boot (HAB), TrustZone, and Cryptographic Acceleration and Assurance Module (CAAM).
- Comprehensive connectivity suite supporting Gigabit Ethernet, USB OTG, PCIe, and multiple serial audio and display interfaces.
Applications
- Automotive infotainment systems
- Digital instrument clusters
- Telematics control units
Procurement Notes
Verify the specific suffix 'ACR' against official NXP documentation to confirm tape-and-reel packaging and mass production status. Ensure compatibility with the Automotive data sheet (IMX6DQAEC) rather than Industrial or Consumer variants. Confirm that the required silicon revision matches the design specifications.
Selection Notes
Select this component when dual-core processing performance combined with automotive reliability is required. The 852 MHz frequency provides sufficient throughput for complex multimedia tasks. Verify that the 624-pin FCBGA package fits the PCB layout constraints and thermal management requirements for the target application environment.
Part Context
This part belongs to the i.MX 6Dual series, designed specifically for automotive applications requiring robust multimedia capabilities. It shares architectural similarities with the Industrial and Consumer grades but differs in temperature rating and qualification standards. The 'D' designation indicates the Dual-core configuration within the i.MX 6 family.
Replacement Considerations
MCIMX6D4AVT08AE: Commercial grade variant with different temperature range. MCIMX6D7CVT08AC: Industrial grade variant with lower clock speed. Verify pinout and software compatibility before substitution.
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