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Product Detailed Parameters
- Description:IC MPU I.MX6D 1.0GHZ 624FCBGA
- Series:i.MX6D
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR)
- Core Processor:ARM® Cortex®-A9
- Number of Cores/Bus Width:2 Core, 32-Bit
- Speed:1.0GHz
- Co-Processors/DSP:Multimedia; NEON™ SIMD
- RAM Controllers:LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:Yes
- Display & Interface Controllers:Keypad, LCD
- Ethernet:10/100/1000Mbps (1)
- SATA:SATA 3Gbps (1)
- USB:USB 2.0 + PHY (4)
- Voltage - I/O:1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:-40°C ~ 125°C (TJ)
- Security Features:ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:624-FBGA, FCBGA
- Supplier Device Package:624-FCBGA (21x21)
- Additional Interfaces:CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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Overview
The MCIMX6D4AVT10ACR is an i.MX 6Dual processor from NXP Semiconductors, designed for industrial applications. It features two Arm Cortex-A9 cores operating at 800 MHz and includes a 1 MB L2 cache. The device integrates multimedia accelerators including a Video Processing Unit (VPU), 3D GPU, 2D GPU, and OpenVG accelerator. It supports DDR3, DDR3L, and LPDDR2 memory interfaces and provides extensive connectivity options such as Gigabit Ethernet, USB, PCIe, and multiple display interfaces.
Feature Summary
- Industrial-grade processing platform with dual-core Arm Cortex-A9 architecture
- Integrated multimedia acceleration suite including VPU and multi-GPU subsystems
- Comprehensive peripheral interface set supporting diverse connectivity standards
- Advanced hardware security features with cryptographic acceleration modules
Applications
- Industrial automation control systems
- Factory floor monitoring and HMI displays
- Smart grid infrastructure controllers
- Medical imaging equipment processors
Procurement Notes
Verify the specific suffix 'C' confirms Industrial temperature grade (-40 to +105°C) matching your environmental requirements. Confirm the 'VT' package designation corresponds to the required 21x21 mm FCPBGA lidded form factor. Ensure silicon revision 'A' aligns with your design-in validation status. Cross-reference the IMX6DQIEC datasheet for exact electrical characteristics.
Selection Notes
Select this component when industrial reliability and multimedia performance are required in a dual-core configuration. Compare against Quad variants if higher CPU throughput is needed, or SoloX models for mixed-signal IoT applications. Evaluate power consumption profiles against external PMIC capabilities. Verify memory interface compatibility with target DDR3 or LPDDR2 specifications.
Part Context
This part belongs to the i.MX 6Dual/6Quad family of applications processors optimized for multimedia and industrial use cases. It shares architectural similarities with consumer and automotive variants but is distinguished by its industrial temperature rating and specific fuse configurations. The series represents a transition point in NXP's embedded processor portfolio focusing on high-performance computing with integrated graphics.
Replacement Considerations
MCIMX6D4CVT10AC: Identical functional specification with different silicon revision. MCIMX6D7CVT08AC: Lower frequency variant (800 MHz vs 800 MHz, check specific speed bin). MCIMX6D4EYM12AE: Consumer grade equivalent with extended commercial temperature range.
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