MCIMX6G2DVK05AA

Overview

The MCIMX6G2DVK05AA is an i.MX 6UltraLite application processor featuring a single ARM Cortex-A7 core operating at 528 MHz. It utilizes a 9x9 mm, 0.5 mm pitch MAPBGA package with 272 pins. The device includes 128 KB L2 cache and supports LPDDR2, DDR3, and DDR3L memory interfaces. Operating temperatures range from 0°C to +95°C. Integrated peripherals include dual Ethernet controllers, dual USB OTG with PHY, dual FlexCAN, Quad SPI, and multiple UARTs.

Feature Summary

• Single-core ARM Cortex-A7 architecture optimized for power efficiency
• Integrated multimedia accelerators including NEON MPE and PXP
• Hardware security features such as CAAM, A-HAB, and TrustZone
• Flexible connectivity supporting Ethernet, USB, CAN, and SDIO

Applications

• Electronics Point-of-Sale devices
• Telematics systems
• IoT Gateways
• Access control panels
• Smart appliances

Procurement Notes

Verify the specific suffix 'VK' confirms the 9x9 mm BGA package and 'A' indicates Silicon Revision A. Confirm the 'D' designation aligns with commercial temperature grades (0 to +95°C). Ensure compatibility with required external memory types such as LPDDR2 or DDR3L based on system design constraints before procurement.

Selection Notes

Select this component for applications requiring a cost-effective, single-core solution with integrated security and multimedia capabilities. The 9x9 mm package suits space-constrained designs. Verify peripheral requirements against the G2 derivative specifications, particularly regarding the availability of dual Ethernet and dual CAN interfaces compared to other variants in the family.

Part Context

This part belongs to the NXP i.MX 6UltraLite family, designed for consumer products. It represents a high-performance, ultra-efficient processor series integrating a single ARM Cortex-A7 core. The family emphasizes low power consumption through smart speed technology and dynamic voltage frequency scaling, targeting embedded market segments.

Replacement Considerations

MCIMX6G2DVM05AA: Identical electrical and functional specifications but utilizes a larger 14x14 mm, 0.8 mm pitch MAPBGA package. Requires PCB layout redesign due to different footprint dimensions.