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Product Detailed Parameters
- Description:IC MPU I.MX6UL 528MHZ 272MAPBGA
- Series:i.MX6UL
- Mfr:NXP USA Inc.
- Package:Tray,Tray
- Core Processor:ARM® Cortex®-A7
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:528MHz
- Co-Processors/DSP:Multimedia; NEON™ SIMD
- RAM Controllers:LPDDR2, DDR3, DDR3L
- Graphics Acceleration:No
- Display & Interface Controllers:LCD, LVDS
- Ethernet:10/100Mbps (2)
- SATA:-
- USB:USB 2.0 + PHY (2)
- Voltage - I/O:1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:0°C ~ 95°C (TJ)
- Security Features:ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Mounting Type:Surface Mount
- Package / Case:272-LFBGA
- Supplier Device Package:272-MAPBGA (9x9)
- Additional Interfaces:CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
- Grade:-
- Qualification:-
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Overview
The MCIMX6G3DVK05AA is an i.MX 6UltraLite application processor featuring a single ARM Cortex-A7 core operating at 528 MHz. It includes 128 KB L2 cache, 32 KB L1 instruction and data caches, and 96 KB Boot ROM. The device supports LPDDR2, DDR3, and DDR3L memory interfaces. Connectivity options include two USB 2.0 OTG ports with PHY, two 10/100 Ethernet controllers, two SDIO/MMC ports, four UARTs, four I2C buses, and four eCSPI modules. It integrates advanced security features such as CAAM, SNVS, and A-HAB.
Feature Summary
- Single-core ARM Cortex-A7 architecture optimized for power efficiency
- Integrated multimedia accelerators including PXP and NEON MPE
- Hardware-enabled security with CAAM and secure boot capabilities
- Flexible connectivity supporting multiple display, camera, and peripheral interfaces
Applications
- Electronics Point-of-Sale devices
- Telematics systems
- IoT Gateways
- Access control panels
- Human Machine Interfaces (HMI)
Procurement Notes
Verify the specific suffix 'VK' indicates the 9x9 mm BGA package with 0.5 mm pitch. Confirm the 'G3' designation corresponds to the full peripheral set including dual Ethernet and dual CAN controllers. Ensure compatibility with the commercial temperature range of 0 to +95 °C. Cross-reference the silicon revision 'A' with current documentation for any errata or maskset updates before finalizing procurement specifications.
Selection Notes
Select this component when a cost-effective, single-core solution is required for consumer applications. The G3 variant provides the maximum peripheral count within the 6UL family, including dual Ethernet and dual CAN interfaces. Consider the integrated power management module to simplify external power supply design. Evaluate the 9x9 mm package size against board space constraints compared to the larger 14x14 mm alternative.
Part Context
This part belongs to the i.MX 6UltraLite family, designed for low-power consumer electronics. It shares architectural similarities with the i.MX 6ULL but offers distinct peripheral configurations and performance levels. The G3 derivative represents a high-feature subset of the series, targeting applications requiring robust connectivity without the complexity of multi-core processors.
Replacement Considerations
MCIMX6G3DVM05AA: Identical functional specifications but utilizes the larger 14x14 mm BGA package with 0.8 mm pitch instead of the 9x9 mm footprint.
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