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Product Detailed Parameters
- Description:IC MPU I.MX6S 1GHZ 624MAPBGA
- Series:i.MX6S
- Mfr:NXP Semiconductors
- Package:Bulk
- Core Processor:ARM® Cortex®-A9
- Number of Cores/Bus Width:2 Core, 32-Bit, 64-Bit
- Speed:1GHz
- Co-Processors/DSP:Multimedia; NEON™ MPE
- RAM Controllers:DDR3, DDR3L, LPDDR2
- Graphics Acceleration:Yes
- Display & Interface Controllers:HDMI, Keypad, LCD, LVDS, MIPI
- Ethernet:10/100/1000Mbps (1)
- SATA:-
- USB:USB 2.0 + PHY (4)
- Voltage - I/O:1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:-20°C ~ 105°C (TJ)
- Security Features:ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:624-LFBGA
- Supplier Device Package:624-MAPBGA (21x21)
- Additional Interfaces:Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
- Grade:-
- Qualification:-
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Overview
The MCIMX6U5EVM10AC is a 32-bit microprocessor unit from the NXP i.MX 6DualLite series. It features dual ARM Cortex-A9 cores operating at a maximum clock frequency of 1 GHz. The device utilizes a 624-LFBGA package with MAPBGA-625 footprint dimensions of 21x21 mm. Core voltage ranges from 1.25 V to 1.5 V, while I/O voltage supports 1.8 V, 2.5 V, 2.8 V, and 3.3 V. It includes 32 KB L1 instruction and data caches per core, 512 KB L2 cache, and 16 KB/128 KB data RAM. Operating temperature spans -20°C to +105°C.
Feature Summary
- Integrates dual ARM Cortex-A9 processor cores for high-performance computing tasks.
- Supports multiple external memory types including DDR3, DDR3L, and LPDDR2.
- Incorporates comprehensive security features such as ARM TrustZone and secure boot mechanisms.
- Provides extensive connectivity interfaces including Ethernet, USB, CAN, and various serial protocols.
Applications
- Consumer electronics devices requiring multimedia processing capabilities
- Industrial control systems utilizing embedded Linux environments
- Smart home gateways and IoT edge nodes
Procurement Notes
Verify the specific suffix designation against official NXP documentation to confirm package type and temperature range variations. Ensure compatibility with required memory controllers and interface configurations before integration. Cross-reference the datasheet errata for known silicon revisions. Confirm RoHS compliance status matches project requirements. Validate supply chain authenticity through authorized distribution channels.
Selection Notes
Select this component when dual-core processing performance is required within the i.MX 6 family constraints. Compare against single-core variants if computational load permits reduction in power consumption. Evaluate thermal management solutions suitable for the specified operating temperature range. Assess pinout compatibility with existing board layouts due to the specific BGA footprint requirements.
Part Context
This part belongs to the i.MX 6DualLite series, designed for cost-sensitive applications needing moderate processing power. It sits below the i.MX 6Dual and above the i.MX 6Solo in the product hierarchy. The series targets markets balancing performance with energy efficiency, leveraging mature ARM Cortex-A9 architecture for stable software support.
Replacement Considerations
Consult official substitution lists for equivalent parts within the i.MX 6 family. Verify functional parity regarding core count and clock speed. Check for pin-to-pin compatibility if direct board replacement is intended without schematic modifications.
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