MCIMX6X3CVN08AB

MCIMX6X3CVN08AB

$32.42
  • Description:IC MPU I.MX6SX 800MHZ 400MAPBGA
  • Series:i.MX6SX
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:8f29d7d000a3 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU I.MX6SX 800MHZ 400MAPBGA
  • Series:i.MX6SX
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:ARM® Cortex®-A9, ARM® Cortex®-M4
  • Number of Cores/Bus Width:2 Core, 32-Bit
  • Speed:200MHz, 800MHz
  • Co-Processors/DSP:Multimedia; NEON™ MPE
  • RAM Controllers:LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:Keypad, LCD
  • Ethernet:10/100/1000Mbps (2)
  • SATA:-
  • USB:USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
  • Voltage - I/O:1.8V, 2.5V, 2.8V, 3.15V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Security Features:A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
  • Mounting Type:Surface Mount
  • Package / Case:400-LFBGA
  • Supplier Device Package:400-MAPBGA (17x17)
  • Additional Interfaces:AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
  • Grade:-
  • Qualification:-

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MCIMX6X3CVN08AB

Overview

The MCIMX6X3CVN08AB is a 32-bit microprocessor from the NXP i.MX 6SoloX series, designed for industrial and consumer embedded applications. It integrates one ARM Cortex-A7 core operating up to 528 MHz and one ARM Cortex-M4 core running at 166 MHz. The device features a MAPBGA-400 package with dimensions of 17x17 mm. Key specifications include 144 kB of data RAM, 96 kB of data ROM, and a 256 kB L2 cache. It supports DDR3, DDR3L, and LPDDR2 memory types. Operating temperatures range from -40°C to +105°C, with I/O voltages of 1.8 V, 2.5 V, 2.8 V, and 3.15 V.

Feature Summary

  • Dual-core architecture combining an ARM Cortex-A7 application processor with an ARM Cortex-M4 real-time controller
  • Integrated multimedia acceleration capabilities including 2D/3D graphics support
  • Comprehensive peripheral interface set supporting Ethernet, USB, CAN, and various serial communication protocols

Applications

  • Industrial control systems requiring mixed processing loads
  • Consumer embedded designs optimized for cost and performance
  • Smart home appliances with connectivity requirements

Procurement Notes

Verify the specific suffix codes against official NXP documentation to confirm pin compatibility and functional variations. Ensure that the MAPBGA-400 package footprint matches your PCB design constraints. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly. Cross-reference ordering information with authorized distributors to ensure authenticity and traceability.

Selection Notes

Select this component when a dual-core solution is required to separate real-time control tasks from high-level application processing. The i.MX 6SoloX series offers a balance of computational power and energy efficiency suitable for battery-operated or thermally constrained environments. Evaluate the available memory interfaces and peripheral counts against system requirements before finalizing the design.

Part Context

This part belongs to the NXP i.MX 6SoloX family, which targets applications needing both high-performance computing and deterministic real-time responses. The series differentiates itself by integrating heterogeneous cores on a single die, reducing board space and power consumption compared to discrete multi-chip solutions.

Replacement Considerations

Check NXP datasheets for direct pin-to-pin compatible alternatives within the i.MX 6SoloX lineup. Verify clock speed and memory controller compatibility if substituting with other variants in the same package.

MCIMX6X3CVN08ABMCIMX6X3CVN08AB
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