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Product Detailed Parameters
- Description:IC MPU I.MX6SX 1GHZ 400MAPBGA
- Series:i.MX6SX
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR),Tape & Reel (TR)
- Core Processor:ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width:2 Core, 32-Bit
- Speed:227MHz, 1GHz
- Co-Processors/DSP:Multimedia; NEON™ MPE
- RAM Controllers:LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:Yes
- Display & Interface Controllers:Keypad, LCD, LVDS
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O:1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature:-20°C ~ 105°C (TJ)
- Security Features:A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Mounting Type:Surface Mount
- Package / Case:400-LFBGA
- Supplier Device Package:400-MAPBGA (14x14)
- Additional Interfaces:AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
- Grade:-
- Qualification:-
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Overview
The MCIMX6X3EVK10ABR is a specialized application processor from the NXP i.MX 6SoloX series. It integrates dual ARM Cortex-A9 cores operating at up to 1 GHz and an ARM Cortex-M4 core running at 227 MHz within a 32-bit architecture. The device features 256 kB of L2 cache, 144 kB of data RAM, and 96 kB of data ROM. It supports DDR3, DDR3L, and LPDDR2 memory types via a 400-LFBGA package. Operating temperatures range from -20°C to +105°C with I/O voltages of 1.8 V, 2.5 V, 2.8 V, or 3.15 V.
Feature Summary
- Dual-core ARM Cortex-A9 processing combined with a low-power ARM Cortex-M4 subsystem for heterogeneous computing.
- Integrated hardware security features including A-HAB, ARM TrustZone, CAAM, CSU, and SNVS.
- Supports multimedia acceleration with NEON MPE and video decode capabilities.
- Comprehensive connectivity interfaces including Ethernet, USB, CAN, I2C, SPI, UART, and SAI.
Applications
- Consumer electronics requiring high performance and low power consumption
- Industrial control systems needing robust security and extended temperature operation
- Smart home devices utilizing embedded Linux and real-time processing
Procurement Notes
Verify the specific suffix 'ABR' against official NXP documentation to confirm tape-and-reel packaging and exact speed binning. Ensure compatibility with required external memory types (DDR3/LPDDR2) and validate that the 400-LFBGA footprint matches the target PCB design. Confirm RoHS compliance status and moisture sensitivity level requirements for assembly processes.
Selection Notes
Select this component when a balance between high-performance application processing and efficient real-time control is required. The inclusion of both Cortex-A9 and Cortex-M4 cores allows for complex OS execution alongside deterministic tasks. Consider the 400-LFBGA package size and thermal characteristics for integration into compact consumer or industrial enclosures.
Part Context
This part belongs to the i.MX 6SoloX family, designed for applications demanding advanced security and multimedia features in a cost-effective form factor. It serves as a bridge between high-end i.MX 6 processors and lower-power i.MX 6UltraLite devices, offering dual-core performance suitable for sophisticated embedded solutions.
Replacement Considerations
MCIMX6X3EVO10AB is a tray-packaged variant of the same silicon. MCIMX6X3EVK10ACR is the reel-packaged version with identical electrical specifications. Verify pinout and software compatibility before substituting packaging variants.
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