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Product Detailed Parameters
- Description:IC MPU I.MX6SX 1GHZ 400MAPBGA
- Series:i.MX6SX
- Mfr:NXP USA Inc.
- Package:Tray,Tray
- Core Processor:ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width:2 Core, 32-Bit
- Speed:227MHz, 1GHz
- Co-Processors/DSP:Multimedia; NEON™ MPE
- RAM Controllers:LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:Yes
- Display & Interface Controllers:Keypad, LCD, LVDS
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O:1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature:-20°C ~ 105°C (TJ)
- Security Features:A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Mounting Type:Surface Mount
- Package / Case:400-LFBGA
- Supplier Device Package:400-MAPBGA (14x14)
- Additional Interfaces:AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
- Grade:-
- Qualification:-
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Overview
The MCIMX6X3EVK10AC is an i.MX 6SoloX processor featuring a dual-core heterogeneous architecture with one Arm Cortex-A9 core and one Arm Cortex-M4 core. It operates at speeds up to 1 GHz for the A9 and 227 MHz for the M4. The device includes a Vivante GC400T GPU, 256 KB L2 cache, and supports DDR3, DDR3L, and LPDDR2 memory interfaces. It provides extensive connectivity including dual Gigabit Ethernet with AVB, USB 2.0 OTG, PCIe, CAN, and multiple display interfaces in a 400-pin MAPBGA package.
Feature Summary
- Heterogeneous dual-core processing combining high-performance Linux execution on Cortex-A9 with real-time control on Cortex-M4
- Integrated multimedia acceleration via NEON MPE co-processor and Vivante GC400T GPU supporting 2D/3D graphics
- Advanced hardware security features including CAAM, CSU, SNVS, and A-HAB for secure boot and data protection
- Automotive-grade environmental support with integrated MLB interface and dual FlexCAN ports
Applications
- Entry-level automotive infotainment systems
- Telematics units
- Human-machine interface (HMI) displays
- Digital instrument clusters
Procurement Notes
Verify the specific suffix 'VK' indicates the 14x14 mm MAPBGA package with 0.65 mm pitch. Confirm that this part number corresponds to the Automotive temperature grade (-40°C to +125°C) as defined by the 'A' in the nomenclature. Ensure compatibility with the required power management ICs such as MMPF0100 or MMPF0200 for system integration.
Selection Notes
Select this component when a balance of application processing and real-time control is required within space-constrained automotive designs. The 14x14 mm package offers a smaller footprint compared to the 19x19 mm variant, suitable for compact HMI or telematics modules. Verify that the specific feature set enabled for the 'X3' silicon revision meets all connectivity requirements, particularly regarding PCIe and LVDS availability.
Part Context
This processor belongs to the NXP i.MX 6SoloX family, designed specifically for automotive and infotainment markets. It represents a shift towards heterogeneous computing by integrating a general-purpose application processor core with a microcontroller unit on a single die. This architecture allows for efficient resource partitioning between complex operating systems and deterministic real-time tasks.
Replacement Considerations
MCIMX6X3EVO10AC
FAQ
What is the maximum operating junction temperature for this part?
The MCIMX6X3EVK10AC is qualified for an extended commercial temperature range with a maximum junction temperature of +105°C.
Does this part number include the full feature set of the i.MX 6SoloX?
No, specific features such as PCIe, LVDS, and certain GPU capabilities may be masked or disabled depending on the exact silicon revision and mask set associated with this part number.
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