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Product Detailed Parameters
- Description:IC MPU I.MX6SX 1GHZ 400MAPBGA
- Series:i.MX6SX
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width:2 Core, 32-Bit
- Speed:227MHz, 1GHz
- Co-Processors/DSP:Multimedia; NEON™ MPE
- RAM Controllers:LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:Yes
- Display & Interface Controllers:Keypad, LCD
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O:1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature:-20°C ~ 105°C (TJ)
- Security Features:A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Mounting Type:Surface Mount
- Package / Case:400-LFBGA
- Supplier Device Package:400-MAPBGA (17x17)
- Additional Interfaces:AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
- Grade:-
- Qualification:-
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Overview
MCIMX6X3EVN10AB is a microprocessor IC from the i.MX6SX series by NXP USA Inc. It features dual ARM Cortex-A9 and Cortex-M4 cores with speeds of 1GHz and 227MHz respectively. The device utilizes a 400-MAPBGA package measuring 17x17 mm. It supports LPDDR2, LVDDR3, and DDR3 RAM controllers. I/O voltages include 1.8V, 2.5V, 2.8V, and 3.15V. Operating temperature ranges from -20°C to 105°C TJ.
Feature Summary
- Dual-core architecture combining high-performance ARM Cortex-A9 processing with low-power ARM Cortex-M4 control.
- Integrated hardware security features including A-HAB, CAAM, CSU, SNVS, and system JTAG protection.
- Supports multiple display interfaces and LCD controllers for visual output applications.
Applications
- Industrial automation systems requiring robust processing and control
- Medical equipment platforms needing secure data handling
- Smart home hubs integrating connectivity and user interfaces
Procurement Notes
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS3 compliance and REACH status prior to integration. Ensure supply chain documentation matches the specific MCIMX6X3EVN10AB part number to avoid counterfeits. Validate packaging integrity upon receipt.
Selection Notes
Select this model for designs requiring heterogeneous computing with separate real-time control and application processing domains. Consider the 400-ball BGA footprint for PCB layout constraints. Evaluate thermal management requirements given the 105°C junction temperature limit. Verify peripheral compatibility with existing Ethernet and USB PHY configurations.
Part Context
This processor belongs to the i.MX6 SoloX family, designed for cost-sensitive embedded applications. It bridges the gap between high-end i.MX6 processors and lower-power i.MX7 devices. The series emphasizes energy efficiency while maintaining sufficient performance for Linux-based operating systems and bare-metal control tasks.
Replacement Considerations
MCIMX6X1EVO10AB serves as a functional substitute within the same i.MX6SX family. Both share identical core architectures and pinouts. Verify specific feature availability differences in official datasheets before substitution.
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