MCIMX6Z0DVM09ABR

Overview

The MCIMX6Z0DVM09ABR is an i.MX 6ULZ application processor featuring a single-core Arm Cortex-A7 operating at 900 MHz. It includes 32 KB L1 instruction and data caches, plus a 128 KB unified L2 cache. The device integrates two USB 2.0 OTG controllers with PHYs, four UARTs, three SAI interfaces, one ESAI, two I2C modules, two SPI modules, and four PWMs. It supports LPDDR2, DDR3, and DDR3L memory types within a 14x14 mm MAPBGA package.

Feature Summary

• Single-core Arm Cortex-A7 architecture with NEON media processing engine
• Integrated power management unit with linear regulators for simplified system design
• Advanced security features including TrustZone, HABv4, and Central Security Unit
• Flexible connectivity supporting multiple multimedia and peripheral interfaces

Applications

• Telematics systems
• Audio playback devices
• IoT gateways
• Access control panels
• Smart appliances

Procurement Notes

Verify the specific suffix 'R' against official documentation to confirm reel packaging details. Ensure compatibility with the commercial temperature grade (0 to +95 °C) specified in the IMX6ULZCEC datasheet. Confirm that the MAPBGA package dimensions match the target PCB layout requirements before finalizing procurement.

Selection Notes

Select this component for cost-sensitive consumer applications requiring efficient processing without high-end graphics capabilities. The integrated power management reduces external component count. Verify interface availability as some pins are multiplexed. Ensure software support aligns with the specific silicon revision indicated by the ordering code.

Part Context

This part belongs to the NXP i.MX 6ULZ family, designed as an ultra-low-cost extension of the i.MX 6ULL series. It targets connected devices and consumer products where power efficiency and functional integration are prioritized over high-performance multimedia acceleration found in other i.MX 6 variants.

Replacement Considerations

Consult the i.MX 6ULZ ordering information table for alternative pin-compatible or functionally similar parts within the same family. Verify junction temperature grades and feature sets when considering substitutes.