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Product Detailed Parameters
- Description:IC MPU I.MX7D 1.0GHZ 488TFBGA
- Series:i.MX7D
- Mfr:NXP USA Inc.
- Package:Tray,Tray
- Core Processor:ARM® Cortex®-A7, ARM® Cortex®-M4
- Number of Cores/Bus Width:2 Core, 32-Bit
- Speed:1.0GHz
- Co-Processors/DSP:Multimedia; NEON™ MPE
- RAM Controllers:LPDDR2, LPDDR3, DDR3, DDR3L
- Graphics Acceleration:No
- Display & Interface Controllers:Keypad, LCD, MIPI
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O:1.8V, 3.3V
- Operating Temperature:-20°C ~ 105°C (TJ)
- Security Features:A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
- Mounting Type:Surface Mount
- Package / Case:488-TFBGA
- Supplier Device Package:488-TFBGA (12x12)
- Additional Interfaces:AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
- Grade:-
- Qualification:-
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Overview
The MCIMX7D3EVK10SD is an i.MX 7Dual application processor featuring two Arm Cortex-A7 cores operating at 1 GHz and one Arm Cortex-M4 core. It utilizes a 12x12 mm BGA package with 0.4 mm pitch. The device supports Industrial temperature range (-20 to +105°C) and includes two Gigabit Ethernet controllers, four tamper pins, and one ADC. Notably, this specific part number excludes the Electrophoretic Display Controller (EPDC) and CAN interfaces.
Feature Summary
- Heterogeneous multicore processing architecture combining dual Cortex-A7 and single Cortex-M4 cores
- Integrated hardware security features including TrustZone, CAAM, and High Assurance Boot
- Support for multiple external memory types including DDR3, LPDDR2, and NAND flash
- Multimedia capabilities with NEON MPE coprocessor and pixel processing pipeline
Applications
- Connected devices and smart appliances
- Human-machine interfaces (HMI)
- Portable medical and health care equipment
- Access control panels and IP phones
Procurement Notes
Verify the exact suffix 'EVK10SD' against the manufacturer's current ordering table to confirm the absence of EPDC and CAN modules. Ensure the industrial temperature grade (-20 to +105°C) matches system requirements. Cross-reference the 12x12 mm BGA package dimensions with PCB layout specifications. Confirm that the 1 GHz CPU speed meets performance needs, as higher frequency variants exist within the family.
Selection Notes
Select this component when industrial temperature operation is required alongside dual Gigabit Ethernet connectivity. The exclusion of EPDC and CAN distinguishes it from other i.MX 7Dual variants. Consider the 12x12 mm package size for space-constrained designs. Verify compatibility with supported external memory standards such as DDR3L and LPDDR3-1066. Evaluate power management requirements given the integrated LDOs and PMU.
Part Context
This processor belongs to the NXP i.MX 7Dual family, designed for low-power, high-performance connected devices. It integrates advanced Arm Cortex-A7 and Cortex-M4 cores with extensive multimedia and connectivity peripherals. The family targets applications requiring secure boot, robust networking, and flexible display options.
Replacement Considerations
MCIMX7D3DVK10SD: Consumer grade, 0 to +95°C, no EPDC/CAN. MCIMX7D5EVM10SD: Industrial grade, -20 to 105°C, 19x19 mm package, no EPDC/CAN.
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