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Product Detailed Parameters
- Description:IC MPU I.MX7ULP 720MHZ 361VFBGA
- Series:i.MX7ULP
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:ARM® Cortex®-A7
- Number of Cores/Bus Width:2 Core, 32-Bit
- Speed:720MHz
- Co-Processors/DSP:ARM® Cortex®-M4
- RAM Controllers:LPDDR2, LPDDR3
- Graphics Acceleration:Yes
- Display & Interface Controllers:MIPI-DSI
- Ethernet:-
- SATA:-
- USB:USB 2.0 (2)
- Voltage - I/O:-
- Operating Temperature:0°C ~ 95°C (TJ)
- Security Features:Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
- Mounting Type:Surface Mount
- Package / Case:361-VFBGA
- Supplier Device Package:361-VFBGA (10x10)
- Additional Interfaces:FlexIO, GPIO, I2C, I2S, SPI, UART
- Grade:-
- Qualification:-
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Overview
The MCIMX7U5DVK07SD is an i.MX 7ULP series microprocessor featuring a heterogeneous multicore architecture with ARM Cortex-A7 and Cortex-M4 cores. It operates at 720 MHz for the A7 domain and 200 MHz for the M4 domain, supporting commercial temperature ranges from 0 to +95 °C. The device integrates Vivante GC7000 Nano Ultra GPU for 3D graphics and GC320 for 2D composition. It includes 256 KB RAM in both domains, LPDDR2/LPDDR3 interfaces, eMMC 5.0 support, and extensive connectivity including USB 2.0, UARTs, SPIs, and I2Cs. The component is housed in a 10 mm x 10 mm BGA package.
Feature Summary
- Heterogeneous multicore processing combining high-performance application domain with ultra-low-power real-time domain
- Integrated Vivante GC7000 Nano Ultra GPU supporting OpenGL ES 2.0/1.1 and OpenVG 1.1
- Comprehensive security features including CAAM, secure boot, and tamper detection
- Flexible input/output capabilities supporting various communication protocols and display interfaces
Applications
- Smartwatches and wearable devices
- Portable consumer electronics
- IoT gateways and edge nodes
- Battery-powered industrial sensors
Procurement Notes
Verify silicon revision compatibility before integration, as errata may affect specific peripheral behaviors or power sequencing requirements. Confirm that the 10x10mm BGA package footprint matches your PCB design constraints. Ensure thermal management solutions are adequate for the specified junction temperature range under maximum load conditions.
Selection Notes
Select this part when system requirements demand distinct separation between rich OS execution and deterministic real-time control within a single chip. Choose this variant over non-GPU versions if graphical user interface rendering is required. Consider the 10x10mm package size against available board space compared to the larger 14x14mm alternative.
Part Context
This component belongs to the NXP i.MX 7ULP family, designed specifically for ultra-low-power applications requiring graphical capabilities. It represents a convergence of application processor performance and microcontroller efficiency, targeting markets where battery life and feature richness are critical competing priorities.
Replacement Considerations
MCIMX7U5DVP07SD offers identical functionality but utilizes a 14x14mm BGA package instead of the 10x10mm form factor.
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