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MCM6729DWJ-10R is listed in the Memory IC range at ChipApex. The manufacturer field lists Samsung Semiconductor, Inc.. Its product description is SRAM ASYNC FAST 1MB 256KX4 5V 32. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MCM6729DWJ-10R
- Description：SRAM ASYNC FAST 1MB 256KX4 5V 32
- Series：-
- Mfr：Samsung Semiconductor, Inc.
- Package：Tape & Reel (TR)
- Memory Type：Volatile
- Memory Format：SRAM
- Technology：SRAM - Asynchronous
- Memory Size：1Mbit
- Memory Organization：256K x 4
- Memory Interface：Parallel
- Clock Frequency：-
- Write Cycle Time - Word, Page：10ns
- Voltage - Supply：5V
- Operating Temperature：0°C ~ 70°C (TA)
- Mounting Type：Surface Mount
- Package / Case：-
- Supplier Device Package：32-SOJ
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MCM6729DWJ-10R
Memory IC Overview
The MCM6729DWJ-10R is an asynchronous static random-access memory (SRAM) integrated circuit manufactured by Samsung Semiconductor, Inc. It features a 1Mbit storage capacity organized as 256K words by 4 bits. The device utilizes a parallel interface and is housed in a 32-pin Small Outline J-Lead (SOJ) package. This component is designed for high-speed data retention and retrieval in embedded systems requiring non-volatile-like performance without the complexity of flash management.
Memory IC Feature Summary
- Asynchronous operation for flexible timing integration
- High-density 1Mbit storage architecture
- Parallel data interface for direct bus connectivity
Memory IC Applications
- Embedded control systems
- Industrial automation controllers
- Telecommunications equipment buffers
Memory IC Procurement Notes
Verify the exact suffix '10R' against official Samsung documentation to confirm speed grade and temperature range specifications. Ensure the 32-SOJ package footprint matches the target PCB design. Confirm end-of-life status or lifecycle recommendations through authorized distributors before finalizing procurement plans.
Memory IC Selection Notes
Select this component when a compact 1Mbit SRAM solution with a J-leaded package is required. Compare pin compatibility and access times with alternative Samsung SRAM families. Consider thermal dissipation requirements associated with the SOJ form factor in enclosed enclosures.
Memory IC Part Context
This part belongs to Samsung's legacy asynchronous SRAM portfolio. It serves as a standard memory solution for older industrial and consumer electronics designs that utilize parallel memory buses. The SOJ package offers a space-efficient alternative to DIP packages for surface-mount assembly processes.
Memory IC Replacement Considerations
Consult official cross-reference guides for compatible Samsung SRAM parts with identical pinouts and voltage levels. Verify electrical characteristics match the system requirements before substituting.
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