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MCP1825T-3302E/DCVAO is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC REG LIN 3.3V 500MA SOT-223-5. Review the specifications below when checking this part for your BOM.
The MCP1825T-3302E/DCVAO is a fixed-output Low Dropout (LDO) linear regulator manufactured by Microchip Technology. It provides a nominal output voltage of 3.3V with a maximum continuous output current capability of 500mA. The device operates within an input voltage range of 2.1V to 6.0V and features a typical dropout voltage of 210mV at full load. Quiescent current consumption is typically 120µA, reducing to 0.1µA in shutdown mode. It includes integrated protection against overtemperature conditions and short circuits.
Verify the specific suffix 'VAO' against official manufacturer documentation to confirm it denotes a valid automotive or qualified variant, as standard datasheets may not explicitly detail this suffix. Ensure the package type matches the required PCB footprint and that the component meets all applicable environmental compliance standards for the target deployment.
Select this component when a fixed 3.3V rail is required with high current demands up to 500mA. It is suitable for battery-powered systems due to low quiescent current. Verify that the input voltage remains above the minimum threshold plus the dropout voltage under all operating conditions to maintain regulation.
This part belongs to the MCP1825/MCP1825S family of 500mA LDO regulators. The 'MCP1825' designation indicates a 5-pin version with Shutdown and Power Good pins, while 'MCP1825S' refers to the 3-pin fixed version. This specific model is a fixed-voltage variant designed for applications requiring reliable power delivery in compact form factors.
Direct replacements include other MCP1825 series variants with compatible pinouts and electrical characteristics. Ensure any substitute maintains the 500mA current rating, 3.3V output, and SOT-223-5 package compatibility. Verify that thermal performance and protection features are equivalent.
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