MCP23017-E/ML

I/o Expanders Overview

The MCP23017-E/ML is a 16-bit I/O expander featuring an I2C interface, housed in a 28-pin QFN package. It operates within a supply voltage range of 1.8V to 5.5V and supports clock frequencies up to 1.7 MHz. The device provides two 8-bit ports (PORTA and PORTB) with configurable interrupt outputs (INTA/INTB). Key electrical specifications include a maximum standby current of 1 µA, output drive capability of 25 mA per pin, and ESD protection rated at 4 kV. Operating temperatures extend from -40°C to +125°C.

I/o Expanders Feature Summary

• Provides 16-bit remote bidirectional I/O expansion via I2C serial interface
• Features configurable interrupt outputs for port A and port B
• Includes polarity inversion register for input data configuration
• Supports hardware address selection for multi-device bus operation

I/o Expanders Applications

• I2C bus peripheral expansion in embedded systems
• Industrial control interfaces requiring wide temperature operation
• Consumer electronics utilizing low standby current modes

I/o Expanders Procurement Notes

Verify the specific suffix 'E' indicates industrial temperature grade compliance and 'ML' confirms the QFN-28 package type. Confirm RoHS status and moisture sensitivity level requirements against project specifications before ordering. Ensure I2C pull-up resistors match the required bus capacitance limits for the selected clock speed.

I/o Expanders Selection Notes

Select this model over the MCP23S17 variant when I2C communication is preferred over SPI. Verify that the host controller supports the required I2C clock speeds (100 kHz, 400 kHz, or 1.7 MHz) based on the operating voltage. Ensure the PCB layout accommodates the 6 x 6 mm QFN footprint and thermal pad connection.

I/o Expanders Part Context

This component belongs to the MCP23X17 family, which includes both I2C (MCP23017) and SPI (MCP23S17) versions. The 'E' suffix denotes the extended industrial temperature range (-40°C to +125°C), while 'ML' specifies the lead-free QFN package. It serves as a direct parallel I/O expansion solution for microcontrollers with limited GPIO resources.

I/o Expanders Replacement Considerations

The MCP23S17-E/ML offers identical functionality but utilizes an SPI interface instead of I2C. Other packages such as SOIC (MCP23017-E/SO) or SSOP (MCP23017-E/SS) provide pin-compatible alternatives if QFN assembly is not feasible.