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SKU:61375611e7de Category: I/O Expanders Brand: Microchip Technology
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MCP23S17-E/ML is listed in the I/o Expanders range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC XPNDR 10MHZ SPI 28QFN. Review the specifications below when checking this part for your BOM.
The MCP23S17-E/ML is a 16-bit serial input/output expander manufactured by Microchip Technology, designed for SPI interface applications. It provides 16 bidirectional I/O pins organized into two 8-bit ports (PORTA and PORTB). The device operates within a supply voltage range of 1.8V to 5.5V and supports a maximum SPI clock frequency of 10MHz. It features configurable interrupt outputs (INTA and INTB), hardware address selection via three pins, and an external reset input. The component is housed in a 28-pin QFN package with dimensions of 6 x 6 mm and is rated for operation between -40°C and +125°C.
Verify the specific suffix 'E/ML' corresponds to the industrial temperature grade (-40°C to +125°C) and the 28-pin QFN package type. Confirm RoHS compliance status and ensure the ordering quantity matches the manufacturer's standard tube packaging specifications. Cross-reference the datasheet revision DS20001952D for any recent pinout or electrical characteristic updates before finalizing procurement.
Select this component when an SPI interface is preferred over I2C due to higher speed requirements or simpler protocol implementation. Ensure the host system provides sufficient current capability, as each output pin can source or sink up to 25mA. Verify that the available SPI pins on the controller support the necessary chip select lines for addressing multiple expanders if required by the design.
This part belongs to the MCP23X17 family, which also includes the I2C variant MCP23017. While functionally similar regarding I/O expansion, the MCP23S17 utilizes an SPI interface instead of I2C. The '-E' designation indicates the extended industrial temperature range, and '/ML' specifies the 28-lead QFN package. It serves as a direct interface replacement for designs transitioning from I2C to SPI architectures.
The MCP23017 is the functional equivalent but uses an I2C interface; software drivers must be adapted. For direct pin-to-pin and register-compatible replacements, verify availability of other MCP23S17 variants with different packages such as SOIC or SSOP, ensuring the thermal performance of the alternative package meets the application's dissipation requirements.
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MCP23S17-E/ML
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