MCP79521T-I/MN

Real Time Clock Overview

The MCP79521T-I/MN is a Real-Time Clock (RTC) and Calendar device from Microchip Technology, housed in a 10-pin TDFN package. It operates within a supply voltage range of 1.8 V to 3.6 V and supports an industrial temperature range of -40°C to +85°C. The component features SPI interface communication, providing accurate timekeeping with calendar functions including leap year compensation. Internal memory includes 2 Kb EEPROM for non-volatile data storage and 64 Bytes of SRAM for user-accessible volatile memory.

Real Time Clock Feature Summary

• Integrated SPI serial interface for system connectivity
• Calendar function with leap year compensation up to 2100
• 2 Kb EEPROM and 64 Bytes SRAM for data retention
• Battery backup switching capability for continuous operation

Real Time Clock Applications

• Industrial control systems requiring precise timing
• Consumer electronics with battery-powered operation
• Data logging devices needing timestamp accuracy

Real Time Clock Procurement Notes

Verify the specific suffix 'MN' against the manufacturer's official datasheet to confirm the exact package variant and tape/reel specifications. Ensure compatibility with the target PCB footprint for the 10-pin TDFN configuration before procurement.

Real Time Clock Selection Notes

Select this model when SPI communication is preferred over I2C or when the specific 2 Kb EEPROM capacity is required. Confirm that the 1.8 V to 3.6 V operating voltage aligns with the system power rails and that the TDFN package fits the design constraints.

Real Time Clock Part Context

This part belongs to the MCP795xx family of compact RTCs designed for low-power applications. It shares functional similarities with other members like the MCP79520 and MCP79521 variants, differing primarily in interface type and memory configuration.

Real Time Clock Replacement Considerations

Direct substitutes include other MCP79521 variants with different packaging suffixes, such as MCP79521T-I/MS. Verify pinout compatibility and interface requirements when considering cross-model replacements.