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MCP795W10T-I/SL is listed in the Real Time Clock range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC RTC CLK/CALENDAR SPI 14SOIC. Review the specifications below when checking this part for your BOM.
The MCP795W10T-I/SL is a battery-backed SPI Real-Time Clock/Calendar (RTCC) manufactured by Microchip Technology. It operates within an industrial temperature range of -40°C to +85°C and supports supply voltages from 1.8V to 3.6V, with backup support down to 1.3V. The device features 1 Kbit EEPROM, 64 bytes of SRAM, and dual programmable alarms. It utilizes a 32.768 kHz crystal or external clock input for timekeeping, offering on-chip digital trimming for frequency calibration. The component is housed in a 14-lead SOIC package.
Verify that the ordering suffix 'T' corresponds to tape-and-reel packaging, as standard datasheets often list tube packaging for the base part number. Confirm the specific package variant (SOIC vs. TSSOP) matches the design footprint, as the datasheet covers both 14-lead options. Ensure the 'I' suffix indicates the industrial temperature grade (-40°C to +85°C) required for the application environment.
Select this model for applications requiring 1 Kbit non-volatile storage and general-purpose SRAM. Choose the MCP795W10 series over the W20 series if only 1 Kbit EEPROM is needed. Consider the MCP795WX1 variants if an EUI-48 MAC address is required in the protected EEPROM area, as the W10 has blank protected memory.
This component belongs to the MCP795WXX family of SPI RTCCs. It shares functional similarities with the MCP795BXX and MCP7951X series but is distinguished by its specific EEPROM capacity and lack of pre-programmed unique IDs in the protected block. It serves as a standalone timing solution for microcontrollers lacking internal RTC peripherals.
The MCP795W10T-I/SN is a direct pin-compatible alternative in the SOIC-8 package. For designs requiring EUI-48 addressing, the MCP795W11 series is a suitable functional replacement. Verify package dimensions when substituting between SOIC and TSSOP variants.
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