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MCT61X is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 2CH TRANS 8-DIP. Review the specifications below when checking this part for your BOM.
The MCT61X is a dual-channel optoisolator manufactured by Isocom Components 2004 LTD. It features transistor outputs and provides high-voltage isolation of 5300Vrms between input and output channels. The device is housed in an 8-DIP package with a pin spacing of 0.300 inches (7.62mm). Designed for through-hole mounting, this component utilizes infrared technology to transmit signals across the isolation barrier while maintaining electrical separation.
Verify the specific suffix code on the component marking to ensure correct packaging and variant selection. Confirm that the 8-DIP package dimensions match your PCB footprint requirements. Check official distributor datasheets for current availability status and lead times as supply chain conditions may vary. Ensure compatibility with operating temperature ranges specified in the manufacturer documentation before integration.
Select this component when dual-channel isolation is required within a single package footprint. The transistor output type is suitable for interfacing with logic circuits. Consider the 5300Vrms isolation rating for safety-critical applications. Verify that the through-hole mounting style aligns with the assembly process. Compare propagation delay specifications if timing sensitivity is a critical design constraint.
Isocom Components 2004 LTD specializes in optoelectronic devices for aerospace and defense sectors. The MCT61X belongs to their line of high-reliability optocouplers. These components are designed to meet stringent quality standards for harsh environments. The company emphasizes rigorous testing procedures for all produced units.
Consult official substitution guides from Isocom Components for verified equivalents. Cross-reference pinouts and isolation voltages carefully. Ensure replacement parts maintain the same transistor output configuration and DIP package dimensions.
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