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The ARIES Embedded MCV-6DB is a System-on-Module based on the Intel Cyclone V SoC FPGA. It integrates a dual-core ARM Cortex-A9 hard processor system (HPS) with FPGA logic resources, including 25K LEs and 36 DSP blocks. The module features 1GB DDR3 SDRAM and 4GB eMMC storage. Operating at 800MHz for the HPS, it provides 145 FPGA I/Os and 181 HPS I/Os via a 360-pin connector. Dimensions are 74mm x 42mm, with an operating temperature range of 0°C to 70°C.
Verify the specific component revision against official ARIES Embedded documentation to ensure compatibility with required firmware versions. Confirm that the 360-pin connector specification matches your carrier board design requirements. Check RoHS compliance status and moisture sensitivity level ratings prior to assembly to prevent handling damage during PCB manufacturing processes.
Select this module when requiring combined FPGA flexibility and ARM processing power in a compact form factor. Consider the 25K logic element count for moderate complexity designs. Evaluate thermal performance within the specified 0°C to 70°C range for your enclosure environment. Ensure sufficient pin availability from the 360-pin header meets all peripheral connection needs.
This module belongs to the MCV series designed by ARIES Embedded for rapid prototyping and production. It leverages Intel's Cyclone V technology to offer cost-effective embedded solutions. The series targets applications needing reliable FPGA-based processing with integrated hard processor systems for efficient software execution.
Consult ARIES Embedded for direct replacements within the MCV family. Verify pinout compatibility if substituting with other Cyclone V SoM variants. Ensure memory configurations and I/O mappings align with existing hardware designs before implementing alternative components.
The hard processor system operates at up to 800MHz.
The device contains 25K Logic Elements.